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Cookson Nabs Patent for Stencil Software
November 29, 2005 |Estimated reading time: 1 minute
JERSEY CITY, N.J. — The U.S. Patent Office awarded patent #6,938,227 B2 to Cookson Electronics Assembly Materials Group for its ALPHA DIMENSIONS stencil configuration, design and ordering software, effective August 30, 2005. Their "System and Method for Modifying Electronic Design Data" patent covers the part of the software that allows unique or custom stencil design rules to be electronically programmed into the system and then automatically applied to any standard stencil data file, creating a new data file that is used to produce the stencil.
Cookson Electronics developed ALPHA DIMENSIONS with the help of ProVision Software, specialists in designing Engineering Automation solutions. Eric Schmidt, ProVision's president, comments, "This patent represents an great example of how current engineering automation techniques can be applied to the stencil manufacturing process for improving consistency and precision."
ALPHA DIMENSIONS is said to reduce variability and inconsistencies in stencil design and manufacturing. Using the findings of a proprietary Print Optimization Study, Cookson was able to pinpoint and eliminate the causes of these problems. On the design side, they include inconsistencies in aperture-design and stencil-configuration rules. On the manufacturing side, they include board-to-stencil alignment, as well as inconsistencies in the stencil manufacturing process itself. The result is a high-precision process tool that allows the application of the precise amount of material in a precise location on the substrate in a repeatable and predictable way, which is ideal for the lead-free transition. For more information, please visit www.alphametals.com.