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IPC/JEDEC Lead-free Conference to Target Components and Assemblies
October 17, 2005 |Estimated reading time: 1 minute
BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries and JEDEC will host the 11th International Conference on Lead-free Electronic Components and Assemblies on December 6–8, 2005, in Boston. To help prepare for such issues as new alloys and materials evaluations, inspection changes, tin whiskers, reliability and increased assembly costs, top experts will come together to deliver an educational program and technical conference.
"All levels of the supply chain are currently trying to successfully implement a lead-free program," says David Bergman, IPC's vice president of standards, technology and international relations. "Bringing the conference 'home' to North America will allow industry members here to learn more about hot issues concerning lead elimination and lead-free alternatives. With the compliance deadline rapidly approaching, information sharing is more critical than ever."
Workshop topics will include: protocols for WEEE and RoHS compliance; rework and repair of lead-free solder joints; impact of RoHS on design, materials, process and reliability of packaging and PCB assembly; best practices in implementing lead-free assembly; key stages of the reflow soldering process; strategies for assuring the reliability of solder attachments, PCBs and components in electronic products subjected to lead-free soldering; key areas in production process/material options and reliability evaluation; and more.
Conference topics will include: case studies in RoHS compliance; aerospace industry response to the global transition to lead-free solder; impact of RoHS compliance on exempt industries; lead-free and miniaturization; and an update on the New England Lead Free Electronic Consortium.
Also, top suppliers will be showcasing their new products and services. For more information about this conference, please visit www.ipc.org/leadfreeNA.