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Water-soluble Solder Paste Ideal for Lead-free
August 17, 2005 |Estimated reading time: Less than a minute
LONDONDERRY, N.H. — Cobar Solder Products' S63-OA water-soluble solder paste is said to offer extended shelf and stencil life, delivering activity and results under thermal load in lead-free reflow soldering processes. Available in most common alloys, including an anti-tombstoning formula and several powder classes, the solder paste demonstrates the ability to print with relatively high speeds in fine-pitch technology applications. Also, residues rinse free in a straight aqueous cleaning process.