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December 31, 1969 |Estimated reading time: 7 minutes
Photo-sensitive Epoxy Material
A photo-sensitive epoxy material for optical waveguides is highly transparent in the near-infrared range. This flexible material uses ultra-violet exposure to create optical circuits, replacing dry-etching processes, and targeting optical circuit boards. The material helps create embedded optical waveguides. The light-transmitting core pattern surface is flat with a rectangular cross-section. The wrapping around the core (clad) also can be embedded, enabling 100-µm film construction on the substrate. The material also features optical characteristics that lead to 0.1-dB/cm losses over a 0.7- to 1.0-µm range. Nitto Denko, Ibaraki City, Osaka, Japan.
Integrated Drive
A versatile Integrated Drive with alignment capacitors, motors and couplers for precision RF match-box network design is said to eliminate the need to source and integrate components from several suppliers. Targeting match-box designs, the drive replaces error-prone manual assembly methods with its easy-to-install subsystem. The drive’s core component is a variable vacuum capacitor, as well as a motor, coupler and tube to drive the capacitor. A backlash-free coupling connects the capacitor to the drive system, while a bulkhead flange and adjustable end flange ease mounting in the match-box. Other features include an optional memory chip and an integrated stepping motor drive and microcontroller. COMET North America, Stamford, Conn.
In-line Label Placement Station
The ELC-200 is a standard, in-line label pick-and-place station that offers a “print on demand” feature, allowing customers to print their labels (based on select criteria) and have them placed onto the PCB. The ELC-200, and its predecessor the ELC-100, can place labels ranging from 7 × 7 mm up to 40 × 40 mm onto PCBs, through the use of an X/Y gantry and a touch-panel interface. The station also features a clamshell design for full access to the labeling system. The station is available in two PCB handling ranges: XL and LLX size internal conveyors. PROMATION, Kenosha, WI.
Selective Soldering Machines
The 300L and 400L selective soldering machines are lead-free compatible and reportedly offer low cost of ownership. The 300L is a solution for selective soldering of thru-hole components post-reflow. Features include bare board or mask grippers, internal spray or drop-jet fluxers and installation of soldering nozzles ranging from 4- to 30-mm. The spray fluxers are ideal for larger areas, while drop-jet fluxers target smaller areas. It is equipped with a pre-heater so large quantities of components may be soldered, and product-specific masks can be used for solder-heated components, while protecting adjacent heat-sensitive components. In post-reflow, the 400L selectively solders conventional components with the functionality of the 300L, and offers a three-stage, in-line system for high-speed, automated soldering. Juki Automation Systems Inc., Morrisville, N.C.
COMPONENTSLow-profile Tantalum Capacitor
A low-profile tantalum solid electrolytic chip capacitor with a conductive polymer electrode meets the “lead-free 3 × 260°C” reflow requirements. The T case, TCJ series tantalum capacitors offer low electro-static resistance (ESR), safer non-ignition failure mode and improved capacitance retention compared to other polymer devices and conventional MnO2 electrode capacitors. With a 1.2-mm profile, the TCJ series offers a capacitance range from 10 to 100 µF. AVX, Myrtle Beach, S.C.
Digital Multimeter
The SMX2055 plug-and-play, PXI/cPCI digital multimeter features 5.5 digits resolution with one million counts. Featuring true 2- and 4-wire Ohm measurement with six ranges from 240 Ω to 24 MΩ, the SMX2055 also reaches over 100 readings per second (rps). Other features include true RMS AC volts and current measurements; diode V/I characteristics at 100 nA and 1 mA; auto-range and relative measurements; and min/max, db and percent-deviation functions. Possessing a look and feel similar to bench-top digital multimeters, the SMX2055 is fully compatible with existing PXI and PCI DMM families for easy upgrades. Signametrics, Seattle, Wash.
Overcurrent Protection Device
The PolySwitch TSM600-400, low-resistance, resettable overcurrent protection device for communication infrastructure applications helps equipment meet standards such as Telcordia GR-1089 Issue 3, UL 60950 3rd edition and TIA-968-A; and can also be used in systems designed to ITU-T K.21 and K.21 recommendations. The RoHS-compliant device features a surface mountable configuration, small footprint and low-resistance for use in high-density, multi-port linecards and other compact communications network equipment. The TSM600-400 device features two matched, low-resistance polymeric positive temperature coefficient (PPTC) components in a single package for balanced resistance characteristics. Each of the two resettable overcurrent components in the TSM600-400 device has a typical resistance of 1.2 Ω; and the components are typically matched to better than 0.3 Ω. The device can interrupt AC power faults and help equipment comply with Telcordia GR-1089 Issue 3 lighting tests. Featuring a rated hold current of 400 mA at room temperature, the device can operate between -40° and 85°C and withstand soldering temperatures up to 260°C for 60 sec. maximum. Raychem Circuit Protection, a business of Tyco Electronics, Menlo Park, Calif.
CONTRACT SERVICESMachine Capability Analysis Testing
Machine Capability Analysis (MCA) testing is a third-party, objective evaluation method in which special vision algorithms, accurate glass plates and components are used to measure Cp and Cpk indices on production equipment. The testing is said to help pick-and-place and equipment manufacturers and users meet the IPC-9850 performance standard. The testing can validate all brands and models of SMT printers, dispensers, placement and semiconductor machines. Software operates the measurement equipment and provides statistical specifications-based results for machine performance. Certification reports validate performance, allowing users to improve product quality and optimize performance, ultimately increasing manufacturing profits. The IPC-9850 standard establishes the parameters, measurement procedures and methodologies used for the specification, evaluation and continuing verification of assembly equipment characterization parameters. CeTaQ America, Hudson, N.H.
Lead-free Transition Services
One challenge in the migration to lead-free products is the need to review each part of your bill of materials (BOM). To help manufacturers with these internal engineering processes, a complete lead-free transition services package consisting of in-house BOM review and conversion, as well as assistance with product redesign is available. Pilot assembly and reliability testing is also available for lead-free product designs. Services are offered as full packages or separately, depending on customer needs. Libra Industries, Mentor, Ohio.
PCBs/SUBSTRATES/LAMINATESRoHS-compliant PCBs
Two RoHS-compliant PCBs produced using a base material designed to withstand the higher process temperatures of lead-free are available with ENIG or immersion silver surface coatings. The boards feature verification of compliance for all base materials and additive processes, process temperatures UL rated to 206°C and full traceability. All PCBs are packaged according to process requirements and a certificate of compliance is included with each date code for shipment. Calumet Electronics Corp., Calumet, Mich.
SMT MATERIALSUltra-thin Shielding Material
The SF PC-5000 EMI shield film was developed for flex interconnects, COF and hinge applications in cell phones, digital camera modules and LCD drivers. With a base dielectric of soft epoxy measuring 5-µm thick covered with 0.1- to 0.15-µm of silver and 17 µm of anisotropic conductive adhesive, the film is well suited for dynamic flex operations and also acts as a cover coat. The SF PC-5000 offers thermal stability during reflow without blistering, warpage and minimal shrinkage. The film is available with a matte black finish and comes with a 50-µm PET transfer film for easy handling and a 120-µm film for protection. Tatsuta System Electronics Co., Tokyo, Japan.
Adhesive Film
I2202F, a high-performance, structural B-staged film adhesive can develop up to 4,500 psi bond strength on difficult-to-bond metal substrates such as gold, invar and nickel, as well as engineering and LCP plastics. The adhesives, which are partially cured and 100% solid B-staged, offer an alternative to liquid adhesives and solders. Unfilled I2202F features suitable chemical, heat and moisture resistance, and is thermally and electrically isolating - halting the migration of heat and electricity. The film can also be filled with thermally or electrically conductive fillers for thermal management, EMI/RFI or solder-replacement applications. The film is available in sheet, preform or roll formats down to 1 mil; and cures in 60 min. at 150°C. TechFilm Corporation, Billerica, Mass.
SOFTWAREMachine Control Software
The TPSys 2.4.3 Linux-based machine control software features vision technology and networking capabilities for high-mix production. Version 2.4.3 includes enhanced assembly speed and a patent-pending calibration method, which uses a smaller calibration device that is moved automatically to several predefined positions within the placement area. An advanced mathematical algorithm then combines the measurements from each position and calculates the correction data for the entire area. Other enhancements include faster tool and conveyor-board changes, as well as improved board-level measurement and optimization. MYDATA automation AB, Stockholm, Sweden.
Downloadable Component Library
A device library is available for engineers designing electronic equipment, such as Wireless Local Area Networks (WLANs), car navigation systems and cellular base stations. The library lets engineers include accurate electrical responses and mechanical layout features for high-performance parts within large-scale PCB analysis. The free device library contains proprietary-equivalent simulation models of the company’s discrete components, including the 938 monolithic ceramic chip capacitors and the 265 chip-coil inductors. Murata Manufacturing Co., Smyrna, Ga.; and Ansoft, Pittsburgh, Pa.
SOLDERING MATERIALLead-free Wave Solder Flux
The 1075-EXR 44 Wave Solder Flux targets lead-free wave soldering of surface mount, mixed-technology and thru-hole electronic assemblies. This water-based, non-flammable flux eliminates special storage requirements and is said to reduce VOC emissions. It provides suitable surface wetting, eliminates cleaning and reduces solder balling for improved solderability on difficult-to-solder assemblies. The 1075-EXR 44 is also suitable for Sn/Pb assemblies. Indium Corporation of America, Clinton, N.Y.
Lead-free Hot-air Leveling Flux
Lead-free DOFLUX material meets the needs for hot-air leveling fluxes that can activate solder coatings at higher temperatures. Said to offer good wetting properties, the flux is part of a family of materials that includes a chemical nickel/gold process for circuit boards and a white-bronze bath for technical and decorative applications. AMI DODUCO, Export, Pa.