New Products
December 31, 1969 |Estimated reading time: 3 minutes
COMPONENTSRF Connectors
The MINI RF series connectors target test and accessory use with telecommunications, consumer, automotive and industrial equipment. Measuring 2.7 × 2.7 mm and 1.6-mm high, they are suitable for small devices requiring antenna- and circuit-performance verification. The components support signal frequencies up to 6 GHz and incorporate 3° misalignments, allowing for angular misalignment when mating sections are engaged. A test-port version for testing electronic circuitry through a pre-transmitting element, and an accessory-port version for testing and redirecting signals through an external transmitting element are available. Operating temperature is -40° to 85°C. ITT Industries Electronic Components, White Plains, N.Y.
HARDWARE/ACCESSORIESIC Adapters
A series of surface mount IC adapters let customers evaluate ICs using test instruments or “known good boards.” Available in SOIC, TSOP, SSOP and TSSOP packages, the adapters feature 8 to 86 pins, as well as a Zero Insertion Force (ZIF) socket on the top for testing and a surface mountable footprint on the bottom. Users can mount the adapter to the PCB, plug the top adapter into the ZIF socket and insert the IC for device testing. A functional test can be run using a known good board with the IC. Adapters.com, Santa Clara, Calif.
INSPECTION EQUIPMENTAOI System
The S3088AV optimized AOI system features full reflow-inspection capabilities. PCB inspection operates in single-track mode, enabling inspection of assemblies up to 400 x 350 mm. High-performance 4M sensor technology locates defects in paste print, component placement and solder joints. Angled camera modules ensure full-depth inspection, detecting critical errors such as lifted leads in the fine-pitch range. Additional modules are available, including a rework station, post-classification station, off-line programming and SPC analysis. Viscom AG, Hannover, Germany.
MATERIALSUV-curable Compound
The UV19 flexible, UV-curable compound is formulated for high-performance laminating, sealing, bonding and casting. The optically clear, mobile liquid uses ambient light to cure to a flexible solid, which adheres to most plastics, glasses and metals. With <300 cps at a 75°F viscosity, the compound can be used to laminate, seal, bond and coat substrates with differing thermal expansion coefficients, such as glass and polycarbonate. Tensile strength of the UV19 exceeds 800 psi, and the compound exhibits high-impact strength, abrasion resistance and heat stability. Master Bond, Inc., Hackensack, N.J.
REWORK/REPAIRAutomated High-volume Rework
The Fineplacer Micro HVR system is designed to address the high-volume rework market where hundreds of boards must be repaired due to high value, component scarcity, or in situations where manual rework is illogical. This tool allows hands-free, automated sequencing of repair steps: component de-solder and discard, residual solder removal and component re-solder. All steps are performed without operator intervention, resulting in a high-yield process. With 10-μm placement accuracy, the HVR is suitable for applications from large BGAs to fine-pitch, small-bump CSPs and flip chips. This lead-free capable system can be configured with solder-paste dispense for 0201 devices, where exact placement and precisely directed airflow prevent component disturbance in densely populated areas. With higher melting point lead-free solders, the HVR can perform for extended periods of time at elevated temperatures (typically 30° to 50°C above Sn/Pb eutectic reflow temperatures). Finetech Inc., Phoenix, Ariz.
SMT MATERIALSSpray Valves
The TS5540 and TS5540F stainless-steel spray valves are suitable for spraying low-viscosity materials, such as conformal coatings, solvents, oils and greases for thin-film fluid deposit. Each valve includes various nozzle/cap configurations for spraying different fluid-deposit patterns and sizes. The TS5540 has three cone-shaped nozzles/caps for spraying three sizes of circular-shaped deposits, while the TS5540F features three fan-shaped nozzles/caps that spray three sizes of elliptical-shaped deposits. Both valves have a 70-psi (4.8 bar) activation pressure, and handle fluid pressure up to 100 psi (6.9 bar). An external stroke control adjusts for fluid flows. Techon Systems, a brand by OK International, Menlo Park, Calif.