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PRODUCT SPOTLIGHT: Automated High-volume Rework
December 31, 1969 |Estimated reading time: Less than a minute
The Fineplacer Micro HVR system is designed to address the high-volume rework market, where hundreds of boards must be repaired due to high value, component scarcity or in situations where manual rework is illogical. This tool allows hands-free, automated sequencing of repair steps: component de-solder and discard, residual solder removal and component re-solder. All steps are performed without operator intervention, resulting in a high-yield process. With 10-µm placement accuracy, the HVR is suitable for applications from large BGAs to fine-pitch, small-bump CSPs and flip chips. This lead-free capable system can be configured with solder-paste dispense for 0201 devices, where exact placement and precisely directed airflow prevent component disturbance in densely populated areas. With higher melting point lead-free solders, the HVR can perform for extended periods of time at elevated temperatures (typically 30° to 50°C above Sn/Pb eutectic reflow temperatures). Finetech Inc., Phoenix, Ariz.