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SMTA International to Present Lead-free Compliance Panel
June 9, 2005 |Estimated reading time: Less than a minute
NASHUA, N.H. — At the annual SMTA International conference to be held September 25-29, 2005, in Rosemont, Ill., a free panel discussion, titled "Lead-free Compliance: Crisis or No Crisis? Everything You Need to Know," will be held on Wednesday, September 28th, from 10:00 - 11:30 a.m.
Focusing on what companies should know to meet the WEEE and RoHS Directives, the featured panelists hail from major facets of the industry to include EMS providers, solder suppliers, pick-and-place equipment manufacturers and test engineers. Gail Flower, editor-in-chief of Advanced Packaging and SMT Magazines, will chair and moderate.
Featured panelists are as follows:
Denis Barbini of Vitronics Soltec Joe Belmonte of Speedline Technologies Peter Biocca of Kester Srini Chada of Jabil Circuit Glen Leinbach of Agilent Technologies Mark Ogden of Siemens David Suraski of AIM SolderFor more information, please contact Gail Flower at gailf@pennwell.com, or simply click here.