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Tin Whiskers Workshop Presents Latest Findings
May 18, 2005 |Estimated reading time: 1 minute
HERNDON, Va. — iNEMI will conduct a tin whiskers workshop on May 31, 2005, as part of IEEE's Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Fla.
Banking on more than 9,000 hours of tin whiskers testing, the full-day workshop will deliver data and theories from industry experts. Having completed its third set of tin whiskers experiments, iNEMI amassed information on tin whisker formation and growth. Presentations also will cover theories regarding the cause and effect of stress formation in tin film, the mechanism by which material moves through the structure and the causes of whisker growth. Data on testing and the impact of heavy oxidation, or corrosion, of tin in humid environments will be explored as well. Dr. Henning Leidecker of NASA will moderate the workshop.
"This is the second year we've organized this workshop, and we expect it to be an important event for everyone concerned about tin whiskers," says Ron Gedney, iNEMI consultant and workshop chairman. "Our speakers include the key people doing research in the area of tin whiskers." The ECTC technical program, which runs from May 31 through June 3, includes a session on solder and tin whiskers on June 1. The iNEMI workshop is $75, and requires participants to register for a minimum of one day's attendance at ECTC. For a full workshop agenda, please click here.