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Lead-free Pastes Combat Voids
May 9, 2005 |Estimated reading time: Less than a minute
TOKYO, Japan — Nihon Almit Co. has introduced two lead-free solder pastes aimed at eliminating voids. Manufactured according to IPC TM-650 and IPC J-STD 005 standards, the pastes are available in Ag3.0/Cu0.5, Ag3.9/Cu0.6 and Ag3.5/Cu0.7 chemistries.
The TM-HP high-preheat solder features temperatures up to 200°C for 120 sec. The TM-HP (L) high-preheat solder is noted at 190°C for 120 sec., and is said to demonstrate suitable printability. Nihon Almit also announced that leading Japanese automotive manufacturers will specify its lead-free solder pastes for their applications.