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New Connector Ideal for Multi-level Board Stacking
March 11, 2005 |Estimated reading time: Less than a minute
NEW ALBANY, Ind. — Samtec's SAL1 Series low-profile, micro-card socket interface provides a card-to-board interface for serial ATA and other high-speed daughtercard applications, and performs up to 3 Gbps.
These interconnects are used in pairs and have large-deflection, beryllium-copper contacts on 1-mm pitch. They are designed to mate with either .0625"- or .094"-thick cards. They can be mounted on the same side of the board, or on opposite sides to increase signal routing flexibility. This connector's design also allows the card to be mated from both sides of the board, and includes weld tabs on both ends for soldering. Four standard pin counts are available with a choice of 20, 27, 30, and 40 I/Os per side.