Universal Adds Knowledge-based White Papers to Website

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BINGHAMTON, N.Y. — Universal Instruments has added seven new white papers to its global Website (www.uic.com), as well as enhanced the site's white paper section with two new subject areas: thermal management and medical electronics.

The new white papers are as follows:

*"Effects of Assembly Process Variables on Voiding at a Thermal Interface"

*"Quality and Reliability Considerations for the Assembly of Implantable Medical Electronics"

*"Low Force Placement Solutions for Delicate and Low I/O Flip Chip Assemblies"

*"Fragility of Pb-Free Solder Joints"

*"Lead-free and Tin-Lead Assembly and Reliability of Fine Pitch Wafer Level CSPs"

*"Study of Alternate Surface Finishes of Quad Flat Packs"

*"Assembly and Reliability Issues Associated with Leadless Chip Scale Packages"

Universal's Website has a dedicated section incorporating almost 60 different industry white papers, covering topics from 0201 assembly, optoelectronics, adhesive and dispensing, to no-lead soldering. Many of them have been presented at industry conferences and events.

Universal is committed to supporting the electronics manufacturing industry by sharing the knowledge gained from the projects undertaken at their SMT laboratories. The white papers are based on the research and development work done at the SMT Laboratory in Binghamton, N.Y., and Technology Excellence Center in Suzhou, China. The latter focuses on optimizing current manufacturing processes, and identifying and advancing the new and emerging technologies that will take electronic assembly far into the future.