APEX Product Preview
December 31, 1969 |Estimated reading time: 9 minutes
The following are some of the many innovative new products that can be seen this month at the combined APEX/IPC Printed Circuits Expo conference and show in Anaheim, Calif.
ASSEMBLY TOOLS & EQUIPMENTMotorized Lift
The BlissLift motorized manufacturing lift features rechargeable batteries, automatic height configuration and a programmable on-board computer. The lift also features an ergonomic design and is said to reduce the time it takes to move heavier PCBs or chassis - improving the handling process. The BlissLift also offers interchangeable batteries and an offline charger so that users never have to stop to recharge. Bliss Industries Inc., Milpitas, Calif.
Process Development Tool
A profiler and process development tool designed to optimize the lead-free thermal process is available. The SlimKIC 2000-LF kit incorporates up to 12 thermocouples and has real-time and datalogging options. The system features a stainless-steel thermal shield and thermocouples rated to handle higher reflow temperatures. The kit also offers Navigator and Auto-Focus to simplify the lead-free reflow process setup. KIC, San Diego, Calif.
RFID Assembly System
A reel-to-reel RFID assembly system includes throughput up to 9,000 cph, 20" wide Web process capability and 12-µm placement repeatability at ±3 Σ. The system offers either passive or active design, direct die pick from wafers down to 0.008" and positive displacement dispense technology. The modular construction allows for future capacity expansion. The system is capable of ancillary component placement and tape-and-reel die placement. It also uses complete closed-loop process control on the thermal compression station to ensure performance consistency. The cure station provides pressure control of each thermode, and real-time feedback provides statistical process control. Tyco Electronics Automation Group, Willow Grove, Pa.
CLEANING MATERIALS & EQUIPMENTStencil Cleaner
The Model 1550 Ultrasonic Stencil Cleaner safely cleans PCBs using low-power density technology. The cleaners have been rated at 10 W/l or less and are said to clean any type of solder paste from a fine-pitch stencil by combining 440-R SMT Detergent with ultrasonic transducers. Smart Sonic, Canoga Park, Calif.
Paste Removal System
SonicOne removes pastes such as rosin, water-soluble and no-clean pastes, and SMT adhesives. It features ultrasonic power that will not damage parts when removing dried pastes on fine-pitch stencils. A wash-solution heater allows for the use of heated chemistries. It also is equipped with a wash-solution and rinse-solution filtration system required for direct-to-drain operation, and features built-in air knives that provide fast drying without the need for potentially damaging heat. All wash, rinse and dry functions are fully programmable and recallable; multiple, user-defined program memories allow for instant storage and recall of process parameters. Aqueous Technologies, Rancho Cucamonga, Calif.
DISPENSING EQUIPMENTMicroprocessor-controlled Dispenser
The DX-300 series includes the DX-300, a microprocessor-controlled dispenser with an operating pressure of 0 to 100 psi for general dispensing applications and the DX-315 with 0 to 15 psi for specific, low-viscosity fluid applications. Each system provides ten programmable memories to store dispensing cycle timing, facilitating uniform sequence dispensing of the bead and dot sizes required in repeatable, high-speed production environments. To control material waste and to ensure precise bead and dot sizes, the series offers an adjustable vacuum and post-dispense vacuum. Both systems have a footprint of 9.25 x 8.5 x 2.5", and include a 100-230 VAC power supply at 50/60 Hz, as well as a full-shot time range of 0.008 to 99.99 sec. OK International, Menlo Park, Calif.
Automated Dispensing System
Featuring a high-contrast color TFT display, the Champion 6809 automated dispensing system can be configured to match exacting application requirements from dots to underfills. Placement accuracy is within 3 µm and the system dispenses dot diameters and bead width down to 75 µm. Volumes are below 0.0000005 cc, and the True Volume Piston positive displacement pump fires up to 90,000 dph. Volume repeatability is 1.7% at 3 Σ. Other features include a standard, three-axis, brushless servo motor drive; X- and Y-axis linear encoders and Z-axis rotary encoding; Windows-based software and an LCD display. Dispense area is 5.5 x 12.0" and resolution and repeatability is ±2 µm for all axes. Creative Automation Co., Sun Valley, Calif.
ENVIRONMENTAL PROTECTIONRecirculation & Filtration System
The RFS-20 recirculation and filtration system recycles rinse water from stencil and batch cleaners, eliminating need for evaporators, haulage or in-house wastewater treatment facilities. The system uses a four-stage filtration system to clean and recycle rinse water. A stainless-steel pump draws fluids from the cleaner’s rinse tank into the recycler. A stainless-steel, in-line solder trap and flow sensor protects the pump. The filtration system consists of an in-line solder trap, a 10-µm polypropylene filter that filters out coarse particulates, an activated carbon powder filter to remove organics and a 5-µm polypropylene filter for fine particulates and organics. Re-circulated rinse-tank water can extend the bath life of both wash and rinse-tank fluids in the cleaner. JNJ Industries Inc., Franklin, Mass.
HARDWARELinear Motor
The open-slot construction of the LMP motor allows for peak force density in the magnetic gap, reaching 12 N/cm2. For applications requiring increased continuous force, a liquid-cooling plate is available. The LMP is available in nine coil sizes with peak force ranging from 5,600 to 27,000 N. The motors range in size from 140 x 500 mm to 340 x 800 mm, and have a height of 32.6 mm without the liquid-cooling plate and 44.6 mm with the plate. A magnetic way cover kit is available for optimal protection against contamination from dust, chips and small particles. It also is compatible with industry-standard three-phase digital brushless motor controllers. An optional Hall sensor module is available for drives requiring a commutation feedback. ETEL Inc., Schaumburg, Ill.
INSPECTION EQUIPMENTDigital X-ray Systems
XiDAT XD7500 digital X-ray system for PCB assembly technologies includes 950-nm feature recognition, oblique angle views up to 70º for any position, and 360º around any point of the 18 x 16" inspection area. This allows the XD7500 to inspect interconnections on BGA and CSPs. The XD7600 X-ray system inspects packages with 250-nm feature recognition and includes a filament-free and maintenance-free X-ray tube. Dage Precision Industries Inc., Fremont, Calif.
AOI System
The Supra M AOI system features full solder-joint inspection and measurement capabilities and comes equipped with one large-format digital camera and a high-precision linear X/Y stage. The camera allows for a configurable field of view and has standard pixel resolution adjustable from 15 to 22 µm/pixel. The system also offers CAD-driven, library-based programming that allows for precise measurement of component placement and solder-joint analysis. In a 960- x 965-mm footprint, the AOI system provides an acquisition speed of 20, 1.4-images/sec. It also offers an inspection envelope of 16 x 18", a height of 2,083 mm and adjustable conveyor height from 735 to 965 mm. The system also features on-the-fly single camera acquisition and improved optics and lighting. Machine Vision Products, Carlsbad, Calif.
Imaging Platforms
A Micron-class high-accuracy mass-imaging platform including the Galaxy and Europa configurations is available with ISCAN (Intelligent Scalable Control Area Network) technology, an Instinctiv user interface and IP-based access to DEK’s knowledge servers through print verification technology. The Micron-class platforms enable next-generation manufacturing, extend uptime and reduce cost of ownership. DEK International GmbH, Flemington, N.J.
PICK-AND-PLACE EQUIPMENTPlacement Machine
The Siplace X-series placement machines incorporate four 20-segment collect & place (C&P) heads, which are designed to process 80,000 cph. The series operates 12- and 6-segment heads as well as a twin pick-and-place head. A vision system and intelligent feeder modules support the head, providing 20,000-cph performance and 4-Σ, 55-µm precision. The platform enables 01005 placement without time delays or accuracy limits. The cast-steel frame keeps vibration and noise to a minimum and holds two, three or four carbon-fiber composite gantries each equipped with a different type of placement head. Consistent single-track principle that covers 8 to 88 mm is suitable for frequently changing products. Siemens AG, Nuremberg, Germany
Platform-based Placement Machine
A platform-based placement machine configurable for flexible-fine-pitch, IC or high-speed chip placement up to 30,000 cph is available with a modular platform design. Claimed to improve flexibility and reliability, the AdVantis head and feeding options deliver improved performance for NPI and first-article build, high-mix/low-volume and high-volume applications. Universal Instruments Corp., Binghamton, N.Y.
Placement Machine
FLX2010 SMD pick-and-place machine features 190 feeders and allows for feeder changeover during operation. Precision drive technology enables the placement of advanced components, such as 0201 or ultra-fine-pitch 0.3 mm. Component range includes tall condensators up to 15 mm, large connectors and BGAs with 50-mm side length. An integrated feeder management system automatically recognizes the feeders and pickup height while LEDs show the feeder status, notifying users if a minimum quantity is reached. Based on barcode identification, the feeder set-up control system excludes set-up failure and guarantees correct placement. The FLX2010 can be expanded to a two- or three-module production line. Additional modules enlarge the feeder capacity up to 300 feeders and can increase production speed from 5,000 to 15,000 cph. ESSEMTEC U.S.A., Glassboro, N.J.
SOFTWAREMeasurement Solution Software
A set of fully automated measurement solutions eliminates the need to determine pass/fail criteria. Each module measures QFP solder joints found on flat ribbon, L and gull-wing lead components as well as fine pitch of micro-lead-frame (MLF) devices. The qfp|module detects, evaluates and indicates failed solder joints, including quality of heel fillet; side and toe fillet; bridges and electrical clearance; opens; side overhang; joint width and toe overhang; lead footprint; co-planarity and voiding percentage. The mlf|module offers quick and repeatable measurements of shorts, voids, opens, mis-registrations and mis-shapes, and can adapt to various land-lead configurations. Both modules can store defect images and detect defects to a local or network drive. phoenix|x-ray Systems + Services Inc., St. Petersburg, Fla.
SOLDERING EQUIPMENTSoldering Machine
Targeting pulse-heat bonding and soldering of flux circuits, the manual hot bar solder machine features microprocessor controls for temperature control. The pulsed heat thermode offers a uniform distribution of heat with rapid heat-up and cool-down. Flexible programmable temperature profiles are created for targeted idle, preheat and reflow. The maximum thermode area is 400 mm2, with a maximum length of 100 mm. Force range is 30 N at 0.09 Mpa to 600 N at 0.6 Mpa with operating temperatures from 0º to 500ºC. An optional color video system is available for manual alignment. Fancort Industries Inc., West Caldwell, N.J.
Spray Fluxer
The TAF40-12F maintenance-free spray fluxer features product memory and enhanced spray efficiency. The fluxer can eliminate regular maintenance, automatic start and shutdown features and fluxing defects on lead-free wave soldering. Other features include design simplicity, touch panels to promote ease of operation, a range of flux types and a preheater for no-clean flux. Exerting minimal spray pressure, using optimal distance from the nozzle to the PCB and using a proprietary Edge-Off feature minimizes flux residue. Tamura H.A. System Inc., Beaverton, Ore.
SOLDERING MATERIALSSoft-residue Solder Paste
EM909 lead-free, soft-residue no-clean solder paste is compatible with 0201 devices and demanding pin-test applications. It reaches printing downtimes up to 60 min. and high print speeds up to 150 mm/sec. The EM909 exhibits continual printability for small apertures such as 0201s and 16-mil. pitch devices. The paste also features solderability in air or nitrogen to numerous surface metallizations, more than 12 hours of stencil life, more than eight hours of tack life and soft post-reflow residues. It is available in Sn 96.5/Ag 3.0/Cu 0.5 and other lead-free alloys. Kester, Des Plaines, Ill.
Lead-free Solder Pastes
A high-performance, lead-free solder paste offering a wide process window is available. The S3X58-M406 features improved tack time; voiding and solder wetting to Cu, NI and Alloy 42 as well as post reflow flux residue properties. As an ICT-testable lead-free solder paste, the S3X58-M650-3 was jointly developed with Western Digital for ICT testability, super fine pattern printability, low voiding and minimal solder beading. The paste also is said to provide high-performance on general requirements, such as long tackiness and powerful wetting. KOKI Co. Ltd.
WORKSTATIONSAdjustable Workstation
Series 6600 adjustable height workstations adjust the work-surface height through a hand crank or motorized drive mechanism. The workstations are available in sizes from 24 x 30" to 48 x 90" with a weight capacity of 1000 lbs. and a height adjustment range of 15.5". Center-justified frames allow two operators to use the station simultaneously. Arlink, Burlington, Ontario