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Experts to Explore Lead-free Challenges in Free Webinar
January 25, 2005 |Estimated reading time: Less than a minute
FRANKLIN, Mass. — SMT manufacturing experts will explore lead-free SMT manufacturing process challenges in a free, live Webinar set for Thursday, February 17, 2005, at 11:00 a.m. (EST).
The one-hour Webinar, to be presented by Speedline Technologies, will focus on the electronics industry's move to lead-free assemblies. Process issues abound throughout the industry as companies begin removing hazardous lead from electronic packages and reducing the dependency on lead materials that can leach into the environment during processing or disposal. The effort is global and is driven by environmental considerations, governmental legislation and the marketing advantages of lead-free electronic packages.
Hosted by experts who have been developing and implementing manufacturing techniques for more than 20 years, the interactive Webinar will feature live discussions of process challenges, new technologies and how-to implementation information, as well as participant questions and answers.
Topics will include:
*Overview of the lead-free transition
*Definition of a lead-free process
*Regulatory update
*Lead-free alloys: advantages and disadvantages
*Process considerations for equipment selection
*PCB design considerations
*Process impact on quality
*Failure modes
To register, or for more information, please visit www.speedlinetech.com/seminars, or call (508) 541-4749.