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Compliant Interconnects Meet SAE/USCAR Requirements
January 24, 2005 |Estimated reading time: Less than a minute
SAN DIEGO, Calif. — AutoPliant 0.64- and 0.81-mm thick compliant interconnects from Autosplice are developed specifically for high-amperage requirements, such as automotive applications. The rugged environment in automotive designs place stringent demands on solderless-type interconnections to consistently maintain optimal retention force and high current-carrying capacity.
Key test parameters include thermal shock, mechanical shock and vibration, and temperature and humidity cycling. In order to qualify for high-reliability automotive applications, AutoPliant components were tested to criteria based on the following two standards; SAE/USCAR2 Revision 4, and IEC 60352-5. They insert directly into the PCB to form a completed interconnection without the need for any subsequent wave- or reflow-solder processing steps, reducing cost and production complexity.