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SMTA International Announces Call for Papers
January 11, 2005 |Estimated reading time: 1 minute
MINNEAPOLIS, Minn. — SMTA International, to be held September 25-29, 2005 at the Donald Stephens Convention Center in Rosemont, Ill., announces the Call for Papers. The SMTA International Technical Committee is now accepting abstract submissions, and short course descriptions are also being solicited.
Papers are being solicited in the following categories:
Emerging Technologies: New Materials and Processes, Consumer Applications, System-in-a-Package, MEMS/MOEMS, Optoelectronics, Wireless Applications, including Bluetooth and Wi-Fi, Nanotechnology, 0201 Components and Assembly, and "Getters."
Components: BGA , Battery Interactions, CSP, including Wafer-level Packages, Component Solderability, Component Reliability, Connectors, Embedded Passives, Failure Analysis, Fine-pitch Technology, Flip Chip/ Direct Chip Attach, Harsh Environments (automotive, military, space), Lead/Termination Finish, Leadless Packaging, and Multichip Packages, including 3-D Packaging.
Assembly: Adhesives, BGA/CSP Assembly, Cleaning, Connector Technology, DFX/Design for Six Sigma, Dispensing, Equipment Selection, Facility Layout, Flux and Solder, Land Pattern Design, Lead-free Soldering (including case studies), Lean Manufacturing, Low Volume/Prototype Assembly, Medical Electronics, Moisture Sensitivity, Placement, Printing, Reflow Soldering, Rework and Repair, Selective Soldering, Set-up Reduction, Solder Paste, Supplier Engineering, Wave Soldering, and Yield Improvement.
PCB Technology: Black Pad, Embedded Passive and Active Components, HDI, Microvias (filled and unfilled), Soldermask, Substrate Reliability, Substrate Solderability, and Surface Finish.
Process Control: AOI, CIM, In-circuit Test, Process Modeling, Software, Test Strategies, and X-ray.
Business: Capacity Modeling, Contract Manufacturing, Doing Business in Asia, Environmental Issues, Lean Manufacturing/Quality Initiatives, Operations Management, Remaining Competitive, RoHS Compliance, Supplier Management, and Technology Roadmaps.
Abstract Deadline: February 7, 2005
Acceptance: April 15, 2005
Manuscripts Due: July 22, 2005
Submit your abstract online at: www.smta.org/smtai/call_for_papers.cfm.
For more information, contact Kristin Nafstad at kristin@smta.org.