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DEK and Kester to Present Latest Findings on Lead-free
January 5, 2005 |Estimated reading time: Less than a minute
FLEMINGTON, N.J. — DEK and Kester have teamed up to present a full-day lead-free seminar in Costa Rica on January 19, 2005. Throughout the event, several lead-free manufacturing issues will be discussed, including the latest lead-free alloys, lead-free wave soldering, the reliability of lead-free and the global impact of lead-free compliance.
Technical papers will also be presented as part of the program, including "Effects of Cooling Speed on Microstructure and Tensile Properties of SnAgCu Alloys" and "Chip Scale Package Rework Considerations: Using Solder vs. Gel Flux."
The impact of lead-free on the screen printing process will also be addressed at the seminar. While many courses leave out any discussion of lead-free's impact on mass imaging, recent research conducted by DEK has shown that paste application method (squeegee vs. enclosed head), stencil material, stencil manufacturing method and machine accuracy all have a tremendous impact on the successful implementation of lead-free manufacturing. The results of these studies will be presented in detail.