2004 Product Review
December 31, 1969 |Estimated reading time: 8 minutes
ASSEMBLY TOOLS/EQUIPMENT
Flat Belt Conveyor
A modular transport solution, Genesis Series F3000 flat belt conveyor can be configured to meet specific user requirements. With the ability to transport PCBs and pallets, this module can be used to incline/decline products from a wavesoldering system using an optional high-temperature ESD belt. The module also can be fitted with a full array of workstation options, which allow it to function as an ergonomic workstation. Standard features are said to include CE compliance with an ESD-safe design, DC speed controller, ESD-safe belting, a maximum temperature of 80°C and adjustable belt tension. Options include a PLC control package with indexing software, including both visual and audible alarms; cooling fans; belt widths of 305, 457 and 610 mm, including nonstandard belt widths; module lengths from 24 to 300" and a high-temperature ESD belt up to 121°C. FlexLink Inc., Bethlehem, Pa.
CLEANING
SMT1000 Lead-free Defluxing System
SMT1000-LF aqueous cleaning/defluxing system is for post-reflow lead-free defluxing applications. The system is equipped with an ultra-high-performance stainless steel nine-stage wash pump, reportedly producing in excess of 110 psi. Additionally, the system features a four-sided rinse section powered by a high-performance stainless steel pump that rotates in four directions to hit the board at every angle and prevent shadowing. This is also segregated from the wash section, preventing cross-contamination and decreasing overall operating costs. The machine automatically performs cleaning, cleanliness testing and drying functions in one footprint. SMT1000-LF is available in zero-discharge configurations, preventing both wash and rinse solutions from entering a user’s drain lines. Unlike most cleaning systems, it does not require connections to either a drain or evaporator. Aqueous Technologies Inc., Rancho Cucamonga, Calif.
MATERIALS
Conductive Alloy
A bulk conductive styrenic alloy, HMS-1000C is electrically conductive because high-structure carbon powder has been incorporated into the styrenic alloy matrix. This is said to make the alloy conductive in three dimensions, while other coated ESD sheets are conductive only on the surface. Because of the thermodynamics of polymeric materials, the least conductive part of the alloy sheet is the outside surface, which is 1 µm per square, the industry standard grounding wrist strap used for ESD protection. HMS Compounds Inc., Mansfield, Texas.
INSPECTION EQUIPMENT
X-ray Inspection System
XiDAT XD7600 X-ray inspection system for PCB assembly reportedly provides for oblique angle views of up to 70º for any position 360° around any point of the 18 x 16" inspection area. This manipulation allows the system to inspect all interconnections on PCBAs, including on BGA and CSP devices. The inspector features NT250, a proprietary filament-free X-ray tube that provides features recognition to 0.25 µm in a maintenance-free package. The tube, coupled with standard active anti-vibration control, is said to provide high-resolution image quality. Dage Precision Industries Inc., Fremont, Calif.
PICK-AND-PLACE
Dip-flux Feeder
The Dip-Flux Feeder reportedly facilitates flip-chip assembly by accurately and precisely fluxing flip chips and other component types prior to placement. The feeder picks up a component from a waffle tray, stick feeder or tape feeder, then dips the component, leads or BGA balls into the rotating flux bath. It then places the component or flip chip onto the board or substrate. The high accuracy of the system is said to enable it to pick pre-flipped flip chips. Component wetting occurs through precisely controlled movement and materials control that ensures repeatability. A fixed squeegee in a rotating flux bath ensures constant flux wave height. Additionally, laser sensors detect approaching components and halt squeegee rotation for the duration of the dipping process. MIMOT, Irvine, Calif.
ASSEMBLY TOOLS/EQUIPMENT
Bench Machine
A new bench machine, designed to deliver superior performance and reliability, has been developed. Combining high functionality with advanced levels of user friendliness, the machine provides fast and accurate terminations, helping to maximize production efficiency. Operating with up to 38 FFC contacts onto foil within the same machine cycle, depending on product pitch, the FFC Terminator is said to deliver a high-quality and precisely repeatable termination process. Pneumatic clamps hold the foil in position-after the operator has placed it on the worktable-and the quantity of contacts to be applied, together with the position and spacing is programmed through a touch screen panel. Tyco Electronics, Bideford, North Devon.
Air-Operated Punch
N200 top-down, air-operated punch is said to singulate tab-routed PCB panels one tab at a time. An upper and lower matching knife blade pinches the tabs apart, reportedly producing less stress on the PCB than a punch and die because the cutting action takes place from both sides. The standard die set cuts a single tab, and the tab is positioned on the lower knife by placing the routed section of the panel on a set of locating pins. This holds the PCB or lets it rest on the support table. Its exact cutting location is adjustable by turning a screw, bringing the locating pins to the desired place for cutting a tab. FKN Systek, Framingham, Mass.
Material Control Platform
Capable of handling material control applications, the company’s platform builds on its MSD control technology. The platform is a set of hardware and software modules that provides a solution on the production floor. Materials may include components, boards, chemicals, feeders and other tooling. Application modules include real-time inventory, line setup validation, MSD control, route control, chemical shelf life control and complete product traceability. The concept of the system reduces the risk of human error by automating quality and process controls while validating that the correct materials are at the right place at the right time. Cogiscan Inc., Bromont, Quèbec, Canada.
CLEANING
Cleaning Agent
VIGON A 300 water-based cleaning agent uses the company’s patent-pending MPC technology. VIGON A 300 not only operates at room temperature, but is also said to be able to clean “hard to remove” flux residues like 3-D. This technology reportedly provides the user with a more cost-effective cleaning process and can be used in high- and medium-pressure spray equipment, such as in-line and/or batch cleaners. ZESTRON America, Ashburn, Va.
Concentrated Cleaning Solvent
AQUANOX A4520 concentrated cleaning solvent is for cleaning reflowed no-clean flux residues. The cleaner reportedly is effective on both reflowed solder paste, as well as uncured SMD adhesives. It is environmentally safe, exceeds current SCAQMD requirements, is effective on solder joints and shows no negative effect after multiple passes through the cleaning process. The solvent features inhibition technology that is said to protect solder joints and bumps from oxidation and provide a brilliant finish after cleaning. The concentrated cleaner is for use on aqueous batch or in-line spray machines, runs clean and exhibits no foaming. Kyzen Corp., Nashville, Tenn.
MATERIALS
Anti-tombstoning Solder Paste
A no-clean solder paste, Multicore 63S4 MP200 is formulated with the 63S4 alloy that reportedly eliminates costly tombstone defects and reduces component misalignment that occurs when reflowing boards with small components. The paste also offers good performance on difficult-to-solder substrates. Suitable for fine-pitch, high-speed printing applications, the material is a drop-in replacement for standard lead alloys, but offers a wider process window to compensate for inaccuracies in screen printing, pick-and-place, and thermal profiling. The paste is said to be formulated to deliver extended abandon time, long open time, slump resistance and increased tack life. It also is suitable for use on various substrates including HASL, OSP copper, gold over nickel and silver immersion. Henkel Loctite Corp., Industry, Calif.
Epoxy Fluxes
Environmentally friendly PK-001 and PK-002 flip chip epoxy fluxes are said to be for use with Sn62 and Sn63 eutectic solders. The fluxes are fast curing, halide-free and no-clean, and can be used for flip chip or chip scale packaging soldering processes. Both materials reportedly feature a stable thermoset residue, compatible with standard underfill materials, conformal coatings, and most finishes and coatings. Methods that can be used to apply the fluxes, include pin transfer, stencil printing, dispensing and dipping techniques. Indium Corp. of America, Utica, N.Y.
Thermal Interface Material
Loctite PowerstrateXtreme is said to be a reworkable, phase-change thermal interface material (TIM) targeted for use between a heat sink and a variety of heat-dissipating components. Upon flow, air is expelled from the interface, thermal impedance is reduced, and the material performs as a TIM. It adheres to heat sinks and devices at room temperature, improving throughput and lowering assembly and energy costs. This TIM is targeted for use as a replacement for thermal grease between processors, MCMs and ASICs and their active heat sinks. Henkel Technologies, City of Industry, Calif.
INSPECTION EQUIPMENT
Microfocus X-ray
Kevex PXS5-927, a 90-kV line of microfocus X-ray sources, is said to build on the company’s integrated X-ray source innovations by integrating the complete X-ray source-tube, power supply and control unit-in one compact package. Additionally, the system is said to provide image resolution of less than 4-µm focal spot, high magnification, and strong focal spot location and X-ray flux stability for microfocus X-ray inspection, high-performance micro CT and other nondestructive test applications. Thermo Electron Corp., Scotts Valley, Calif.
Large-view Inspection Area
TIGER X-ray inspection system now features an extended oblique view inspection area (OVIA) for 24 x 24" boards. The enlarged capabilities reportedly allow operators to inspect up to 24 x 20” at full oblique angles and highest magnification. A large viewing area is key to high-magnification X-ray inspection of large boards because it is said to enable even the edges of the board to be inspected with full tilt and rotate parameters. Additionally, it allows users the freedom to view a set of smaller samples spread over the entire sample tray. FEINFOCUS, Stamford, Conn.
PICK-AND-PLACE
Feeder System
The Triligent-triple intelligence-feeders can add speed, versatility, flexibility and efficiency to the pick-and-place process. Available in both tape and stick configurations, the feeder maintains uninterrupted, high-speed communication with the pick-and-place machine, whether the feeder is mounted on the machine or in a storage rack. It features a multiple LED status indicator and operator signaling display on each feeder. MIMOT, Irvine, Calif.
A-Series: AX Platform
The AX platform can change with production requirements. Multiple process heads operating in parallel on a fixed-length machine allow a manufacturer to purchase the machine configuration ideally suited to its current production requirement. As the requirement fluctuates, the manufacturer purchases, rents or transfers heads between machines to meet the new requirement. The platform ensures that placement capacity equals production requirements. The TrueModular design affords production scalability without disturbing factory or line layout. With up to 20 process heads per base, the system achieves 100,000 pph (IPC-9850 data). If production does not require 100,000 pph, manufacturers can exchange placement heads for process heads. Assemblèon, Veldhoven, The Netherlands.