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SMTA Expands Knowledge Base Online
November 16, 2004 |Estimated reading time: Less than a minute
Minneapolis, Minn.—The SMTA Knowledge Base on http://www.smta.org is a searchable archive of all technical papers presented at SMTA conferences and featured in the SMTA Journal. It currently consists of over 1500 full-length technical articles from conferences such as SMTA International and the Pan Pacific Microelectronics Symposium.
Papers in the Knowledge Base date back as far as 1996 and cover the full range of issues in electronics manufacturing, including lead-free, assembly, design, packaging, soldering, quality, test, reliability and related business issues. Most recently, 74 papers have been added from the 2004 Pan Pacific Microelectronics Symposium and from the first-ever SMTA Medical Electronics Symposium.
53 papers from the Pan Pacific Microelectronics Symposium cover topics such as flip chip, 3-D packaging, novel chip connection, embedded components, design and modeling, reliability, PWB materials and processes, SMT assembly optimization, packaging materials, inspection and test, industry and research standards, lead-free, power device packaging, optics, and MEMS and nano technologies in high-reliability applications.
21 papers from the SMTA Medical Electronics Symposium explore devices, components, packaging, and assembly technologies from technical sessions on design/reliability, manufacturing - techniques and requirements, process and quality control, packaging, sensors/MEMS, and business/regulations.