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Speedline Technologies Schedules Free Monthly Technical Webcast Seminars
October 13, 2004 |Estimated reading time: 1 minute
Franklin, Mass.—Speedline Technologies has scheduled a series of free monthly technical webcast seminars exploring the major challenges facing engineers in the semiconductor manufacturing process. Each of the seminars, to be hosted by industry experts, will include the sharing of "knowledge-in-process" expertise, how-to insights and a Q&A session. The schedule is as follows:
Improving Final Product Quality
* Thursday, October 21, 2004* Live: 11:00 am - Noon, ET, and* Live: 2:00 pm - 3:00 pm, ET
The cost of a defect increases exponentially as it moves through the production process. A defect that ships to a customer costs hundreds of times more than an error that is discovered immediately after the printing process. However, even in a well-controlled production environment, defects still occur. What can be done to limit the number of defects and their impact on your production capabilities? This seminar will cover the following topics:
-Cost and types of a defect-Impact of printing defects on first pass yield-Preventing defects-Inspection and test process planning-2D and 3D solder paste inspection
Reliable Underfill Dispensing* Thursday, November 18, 2004* Live: 11:00 am - Noon, ET, and* Live: 2:00 pm - 3:00 pm, ET
There are many applications for underfill dispensing, and all require significant knowledge about the various materials and equipment used for the process. This chip connection process step is critical for flip chip manufacturing, and can use many types of materials. This seminar will cover the following topics:
-Why use underfill?-Underfill materials-Underfill process variables-Improving material flow-Equipment variables-Equipment optimization and dispensing patterns
Fine Pitch Printing Process
* Thursday, December 16, 2004* Live: 11:00 am - Noon, ET, and* Live: 2:00 pm - 3:00 pm, ET
As technology continues to move towards smaller components, it becomes increasingly important to print to meet fine pitch requirements. With 0201 chips, chip scale packages and micro BGAs becoming more prevalent, a process engineer must fully understand every aspect of the fine pitch printing process. Topics in this seminar will include:
-Squeegee selection-Solder paste evaluation-Lead-free solder paste printing-Stencil design, including pin-in-paste-Aperture design-45 degree printing-Board support-Fast cycle time printing-Post-print inspection (2D and 3D)
To register or for more information, visit www.speedlinetech.com/seminars on the Web, or call (508) 541-4749.