-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
KIC Announces Hands-on Lead-free Workshop in October
August 17, 2004 |Estimated reading time: 1 minute
San Diego — KIC will co-sponsor a lead-free workshop from Wednesday, October 13 to Thursday, October 14, 2004 at Engent's facility in Norcross, Ga.
The workshop is co-sponsored by Engent, Henkel Technologies and Speedline Technologies.
The conversion from a leaded to a lead-free process is not simple. A solid understanding of the alloys, fluxes, board and component finishes, and how they impact the process will be required. Additionally, another critical aspect of converting to lead-free is the shrinking process window caused by the higher solder melting temperatures coming up against the temperature tolerances of the most sensitive components.
This two-day, hands-on training program will provide participants with a broader knowledge of lead-free material interactions, as well as a greater understanding of the process, including advantages and limitations. A sample lead-free board manufactured over the two-day course will be produced and taken away by each attendee. Additionally, engineering and technical representatives will be available for one-on-one discussion.
A panel of industry experts will be present, and will discuss the following:
- Neil Poole, Ph.D. of Henkel Technologies will present on alloys reliability, material interactions, surface mount adhesives, underfills and conformal coatings.
- Daniel Baldwin, Ph.D. of Engent will discuss process engineering methods, analytical tools and design of experiment (DOE).
- Keith Howell of Speedline Technologies will present on wave and reflow processes.
- Marybeth Allen of KIC will discuss thermal profiling technologies for lead-free applications.
The workshop, designed for engineers and engineering management, will feature ample hands-on production floor training in the following areas:
- Screen printing surface mount adhesives and solder paste, as well as placement
- Reflow profiling
- Rework
- Inspection/analytical
- Wave.
On October 13, registration will begin at 8 a.m., and sessions will convene from 8:45 a.m. until 5 p.m. On October 14, sessions will take place from 8 a.m. until 5 p.m. A reception will be held for attendees on October 13 from 6 to 8 p.m. at the Holiday Inn Select, located at 6050 Peachtree Industrial Blvd., Norcross, Ga. 30071; (770) 448-4400.
A detailed agenda, as well as additional information is available at www.kicthermal.com/index.html.
KIC is an industry leader in automated thermal management tools and systems for reflow, wave, cure and semiconductor thermal processes.