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Henkel Future Trends Seminar Draws Standing Room Only Crowd
August 2, 2004 |Estimated reading time: 1 minute
San Jose, Calif. — On July 13, 2004, at the Marriott Hotel here, experts from the semiconductor packaging market presented a four-hour, in-depth seminar addressing the challenges facing tomorrow's packaging professionals.
Co-sponsored by SEMI's International Electronics Manufacturing Technology (IEMT) Symposium and Henkel Technologies, the first annual "Future Trends in Semiconductor Packaging" seminar attracted more than 120 attendees.
Data were presented on various topics, including low k devices/Cu interconnect, lead-free material sets, stacked die packages, the need for "green" packages, thermal management and high-speed dispensing. Presenters included Mike Steidel of Amkor Technology; Vijay Wakharkar of Intel; Kishor Desai of LSI Logic; Dev Malladi of Sun Microsystems; E. Jan Vardaman of TechSearch International; Steve Adamson of Asymtek; and Gordon Fisher, Jim Huneke and Michael Todd of Henkel Technologies.
Keeping up with shifting technology and the regulatory and economic pressures of the microelectronics industry can be overwhelming. As electronic devices become increasingly smaller, lighter and more powerful, semiconductor professionals must remain up to date with current technologies, while preparing for the inevitable challenges of next-generation packaging. The seminar presented by Henkel Technologies and IEMT gave attendees a leg up on what tomorrow's manufacturing processes may look like and armed them with data to help prepare for the challenges ahead.
To obtain a copy of the "Future Trends in Semiconductor Packaging" proceedings or to inquire about Henkel Technologies' semiconductor packaging materials, call (626) 968-6511.