-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA Hutchins Grant Award Recipient for 2004 Announced
July 29, 2004 |Estimated reading time: 1 minute
Minneapolis — Brian McAdams from Lehigh University, Bethlehem, Pa. has been selected by the SMTA Grant Committee to receive the 2004 Charles Hutchins Educational Grant for his project entitled "Sub-critical Initiation of Delaminations at the Underfill/Passivation Interface in Flip-chip Assemblies".
McAdams is a graduate student in the field of materials science and engineering. Recently his experience has been in conducting studies of cure kinetics of developmental epoxy systems, studying the mechanics of adhesion for both the initiation and propagation of cracks at the underfill/passivation interface in flip-chip packaging, and examining the role of deformation mechanisms in determining interfacial adhesion and the potential correlation to chemical interactions across the interface.
In his professional pursuits, McAdams hopes to work in the field of electronics assembly and packaging and to continue efforts on materials characterization, failure analysis, or research and development of flip-chip assemblies. He is a student member of SMTA, and he enjoys multitasking and working in group settings.
McAdams' project was selected from many applications reviewed by SMTA members and industry educators. The award includes $5,000 (which goes directly to the student) and travel expenses to SMTA International, during which McAdams will be presented the award at the SMTA Annual Meeting by Hutchins Grant Committee chairperson Laura Turbini, Ph.D. of the University of Toronto.
This grant was established in memory of past SMTA president and industry colleague Charles Hutchins, who died in May 1997. For more information visit the Hutchins Grant section at www.smta.org/hutchins/hutchins.cfm or contact SMTA executive administrator JoAnn Stromberg at (952) 920-7682 or joann@smta.org.
For more information on the events during SMTA International, visit the online conference brochure at www.smta.org/smtai/.
The SMTA membership is a network of professionals who build skills, share practical experience, and develop solutions in electronic assembly technologies and related business operations. For more information, visit www.smta.org.