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Intel Facing Myriad Challenges and Changes, Says In-Stat
July 21, 2004 |Estimated reading time: 1 minute
Scottsdale, Ariz. — According to In-Stat/MDR, Intel, the world's leading semiconductor manufacturing company, is in the midst of many changes in its microprocessor product portfolio and manufacturing strategy.
In 2004, Intel is ramping production of new desktop and mobile microprocessors in Prescott and Dothan, respectively. In addition, Intel has announced the introduction of dual-core processors beginning in the second half of 2005 to overcome the growing problems of leakage current and power consumption associated with smaller manufacturing process technology and increasing operating frequencies. This will be accompanied by a shift in marketing from microprocessor speed grades to other feature and performance characteristics.
Intel is also ramping production on a 90 nm process using 300 mm wafers in 2004. The new process increases the number of potential units four times over the older 0.13 µm process using 200 mm wafers. Intel's fab expansion strategy is also changing to favor the retooling of older fabs over building new megafabs.
The high-tech market research firm has also found that:
- With four 90 nm fabs in production and two 65 nm fabs ramping towards the end of 2005, Intel has more capacity than it can use for just IA-32 and IA-64 processors. As a result, Intel will begin shifting other products, such as chipsets, to the 90 nm process.
- Intel will face a new capacity model starting in the 2H05 when it begins shipping dual-core processor solutions into desktop, mobile and server platforms. The switch to dual core solutions is being driven by increasing static leakage problems as the process technology transitions to 90 nm and beyond.