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Amsterdam Conference on Lead-free a Success
July 14, 2004 |Estimated reading time: 2 minutes
Amsterdam, The Netherlands — European delegates from the electronics industry gathered here at the end of June for the second jointly sponsored IPC/Soldertec Lead-free Electronics Conference, "Towards Implementation of the RoHS Directive."
The two-day conference program at the Amsterdam RAI International Exhibition and Congress Center was preceded by a day of technical workshops presented by Ron Lasky, Ph.D. of Indium Corp., Bob Willis of EPS, Bill Plumbridge, Ph.D. of the Open University, and Soldertec Global Lead-free Award winner Ning-Cheng Lee, Ph.D., also of Indium.The event was attended by more than 180 delegates, mostly European but also from as far as the U.S. and Asia, including a group of 12 attendees from the People's Republic of China. The program began with Steven Andrews, Department of Trade and Industry, UK, who provided an update on RoHS as well as EU member state implementation. The conference offered more than 40 speakers, including Hu Zhixin speaking on the situation and development of lead-free solders in China, Adolf Mikula from Vienna University discussing the Cost 531 European Action on lead-free soldering program, and Jeremy Pearce, Ph.D., from Soldertec Global discussing the ELFNET project.The program had a strong technical content and papers were of a high quality, according to Soldertec. Preeminent international speakers shared their lead-free knowledge and experience and answered questions at the end of each session. A main topic of discussion was component compatibility. Issues raised included labeling, lead finishes, MSLs, high temperature compatibility and obsolescence.According to Soldertec, electronic assemblers believe they can control the higher temperatures required for lead-free processes and have PCB suppliers who can offer a lead-free finish. Their perceived problems are coming from the component suppliers. The link between assembler and vendors of PCBs and consumables often is closer than that between assembler and component manufacturer and they feel that their questions are not being heard. There is little time left between now and July 2006, but the component manufacturers that can bridge this gap will see big rewards.Copies of the proceedings, all 40+ speakers including Denis Barbini of Vitronics Soltec, Paul Evers of Philips, and Karin Schottenloher of Siemens VDO Automotive,are available on CD-ROM for £ 125 (converts to US $233) by e-mailing info@lead-free.org Soldertec Global is a membership-based organization. Members receive a package of benefits that aims to provide access to leading-edge lead-free research and information within a community of key electronics industry technologists. For more information, visit www.lead-free.org.