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Asymtek, Cookson Materials Group Work Together on Jetting Underfill Project
April 26, 2004 |Estimated reading time: Less than a minute
Carlsbad, Calif. and Alpharetta, Ga. — To obtain optimal process solutions for their customers, Asymtek teamed with Cookson Electronics' Semiconductor Products Division on a new project to jet underfill.
Cookson Electronics — Semiconductor Products visited Asymtek's application labs to test their fluid materials on Asymtek's X-1000 Series, configured with the new DJ-9000 DispenseJet.
The two companies work together as a part of Asymtek's "Win3" program, in which key fluid formulators, technology institutes and equipment suppliers join together for the benefit of customers, each other and the industry as a whole. One common customer uses Asymtek's Axiom and Millennium platforms with the DispenseJet and DP-3000 pumps for dispensing underfills. A die placement machine, reflow oven and batch oven are in line with the dispensing equipment. The customer reported better dispense volume control with Asymtek's jetting technology and Cookson's Staychip 3082 underfill material.
Asymtek supplies award-winning automated fluid dispensing systems, specializing in semiconductor, surface mount and electronics packaging applications. For more information, visit www.asymtek.com.
Cookson Electronics — Semiconductor Products is a world leader in the development, manufacturing and sales of innovative materials used in semiconductor packaging for area array and flip chip packages. For more information, visit www.cooksonsemi.com.