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IPC, Soldertec Global Issues Call for Papers for European Lead-free Conference
February 24, 2004 |Estimated reading time: 2 minutes
UK and Northbrook, Ill. — Following the success of last year's first International Conference on Lead-Free Electronics to be held in Europe in Brussels, preparations are now being made for the 2004 event.
IPC — Association Connecting Electronics Industries, and Soldertec Global, a division of Tin Technology, will be sponsoring this year's conference, which will be held in Amsterdam June 21 through 23, 2004. This international conference is expected to feature papers from many countries, including China where legislation similar to the RoHS Directive now is being introduced. Engineers and policymakers from the global electronics industry are invited to participate in this conference and now are being offered the opportunity to give a presentation, or hold an educational course by responding to the call for papers.To submit a presentation for the conference, speakers should send a short abstract along with a brief biography and a topic submission form to Soldertec Global; more detailed information is attached and is also available from the Soldertec Global Web site. The deadline for abstract submission is March 24, 2004. Speakers will be entitled to receive discounted admission to the conference, including a copy of proceedings and any refreshments. The program will be available at the beginning of April 2004.The conference will be held at the RAI International Congress and Exhibition Centre in Amsterdam. The city has easy train and air links to many parts of Europe. For more information on the conference program, send contact details to LFAmsterdam@ipc.org. Companies interested in sponsorship and exhibition opportunities should e-mail Alexandra Curtis at AlexandraCurtis@ipc.org There also are openings for half or one-day tutorials. Suggested topics include reliability, process issues, rework, plating and surface finishes, design for lead-free, and design for recycling. A brief description and additional information on any proposals should be submitted according to the guidelines for abstract submission and the deadline of March 24, 2004, is applicable. Papers are sought in all areas, including:
- European/Chinese/other legislation on hazardous materials and recycling
- Legislative compliance, policy enforcement and product marking
- Summary of voluntary implementation in other regions (America, Japan, Australia, Taiwan, etc)
- Company and research consortia projects and results
- Design issues (for ease of production and disassembly)
- PCB issues (effects of lead-free process temperatures, board finishes, etc)
- Component issues (effects of lead-free process temperatures, BGAs, obsolescence, etc)
- New finishes (plating technology, solderability and tin whiskering)
- Comparisons of mainstream (e.g. SnAgCu, SnCu) and specialist (e.g. SnZnAl) solder alloys
- Alternative means of substitution (conductive adhesives, etc)
- Lead-free manufacturing (examples of implementation, process considerations, inspection, etc)
- Repair and rework (process control, mixed alloy systems, etc)
- Reliability evaluations (research, product test and in-service, including new test methods)
- Lead-free and other product sectors (automotive, aerospace ,etc)
- Environmental considerations and studies (material availability, toxicity issues, etc)
- Recycling (examples, plans and concerns)
- Business issues (supply chains, cost — benefit analysis etc)
Soldertec is a membership-based organization focusing on research into soldering technology, including lead-free issues. It is part of the Materials Division of Tin Technology, a company supported by major tin producers and tin-consuming industries worldwide and is at the cutting edge of research and development into tin-based applications. For more information, visit www.lead-free.org.