Universal, Hitachi Extend High-speed Placement Collaboration

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Binghamton, N.Y. — Universal Instruments and Hitachi High Technologies (HHT) have renewed their OEM agreement for five more years.

HHT acquired Sanyo High Technologies, Universal's original OEM partner, in 2003. The partnership has enhanced Universal's product portfolio with turret-style, high-speed placement technology while affording HHT an extensive sales and support network. Since being first announced in 1989, this agreement has resulted in more than 1,200 HSP platforms sold. The latest high-speed placement machine to use HHT's technology is the 4797L HSP.

In addition to customers' access to the entire line of 4797 Series HSP machines, extending the agreement until 2009 will allow further joint efforts to continue. These include recent line software development work, and may extend in the future to additional joint technical projects, technology transfers and further product sharing.

Continued success of the partnership, as well as sustained market demand for high-speed placement equipment such as the 4797L HSP, have allowed the agreement to be renewed several times in the past. Universal offers the 4797 Series HSP alongside its modular platform product portfolio, which includes the AdVantis and GSM Genesis placement platforms, as well as end-of-line and through-hole assembly solutions.

Universal Instruments is a global electronics productivity specialist, providing innovative circuit, semiconductor and back-end assembly technologies and equipment, integrated system solutions, and process expertise to manufacturers in every sector of the electronics industry. For more information, visit www.uic.com.



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