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AIM Announces Lead-free Electronics Assembly Workshop
February 2, 2004 |Estimated reading time: 1 minute
Montreal, Canada — AIM has announced an all day lead-free seminar to take place in Sydney, Autralia on March 23rd, 2004.
Future workshops are being planned at various locations worldwide.To successfully achieve lead-free electronics assembly, each participant in the manufacturing process, from purchasing to engineering to maintenance to quality, must have a solid understanding of the changes required of them. While there are many theoretical workshops on lead-free assembly, this seminar focuses on the practical considerations for achieving successful lead-free assembly at a factory.Each step of the manufacturing cycle is addressed, from purchasing parts to inspecting assembled PCBs. Solid advice, real-world examples and helpful images of the means to overcome the many challenges of lead-free assembly are presented, including:
- The status of lead-free legislation, marketing, and implementation worldwide.
- Reasons for hesitation to move towards lead-free soldering
- Design considerations
- Component concerns
- Circuit boards
- Solder alloy considerations
- Lead-free alloy requirements
- Lead-free vs. tin-lead
- Lead-free alloys process and materials compatibility
- Comparison of various lead-free alloys
- Flux considerations
- Equipment considerations
- Materials management issues
- Lead-free assembly best practice for printing, reflow, wave soldering, rework, cleaning, equipment wear and tear, and test and inspection
- Establishing your implementation plan for Pb-free.
The instructor of the workshop is Karl Seelig, vice president of technology of AIM. In his 25 years of industry experience, Seelig has authored more than 20 published articles on topics including lead-free electronics assembly, no-clean flux technology, assembly and process optimization, inspection, and metallurgical studies. Seelig has numerous awards and patents in soldering technology, including four for lead-free solder alloys, and has been one of the key developers of no-clean technology.Seelig has been a member of several industry organizations, consortiums and committees including the IPC J-STD-006 Solder Alloy Task Group. He currently is the chairperson of the IPC's Solder Products Value Council's Lead-free Subcommittee. This subcommittee is comprised of executives from all major solder companies in the world and is actively working to select a default lead-free solder alloy based on technical and commercial merits.
AIM is a leading global manufacturer of assembly materials for the electronics industry. The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms and specialty alloys such as indium and gold for the electronics assembly, PC fabrication, component manufacturing and other industries. For more information, visit www.aimsolder.com.