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IPC and JEDEC Leading the Way to Lead-free
January 15, 2004 |Estimated reading time: 2 minutes
Northbrook, Ill. — IPC — Association Connecting Electronics Industries and JEDEC, the Solid State Technology Association, have announced plans to further their efforts in preparing electronics manufacturers for the inevitable European ban on lead by co-sponsoring three International Conferences on Lead Free Electronic Components and Assemblies in the U.S., Europe and Asia in 2004.
Ever since the European Union agreed upon the Restriction of Hazardous Substances in Electrical and Electronic Equipment Directive, in which all affected electrical equipment sold in Europe after July 1, 2006, must be free of lead, IPC and JEDEC have taken an active role in keeping the industry informed of changing requirements and encouraging the voluntary elimination of lead. In just its second year of jointly producing domestic and international conferences on lead-free electronics, IPC and JEDEC will host their fifth, sixth and seventh lead-free conferences on March 17 through 19, 2004, in San Jose, Calif.; in August 2004 in Singapore and on October 20 through 22, 2004, in Frankfurt, Germany.
Each international conference provides tutorials focusing on such subjects as manufacturing with lead-free, halogen-free and conductive adhesive materials, as well as various workshops that, among other things, introduce lead free solders and present selection criteria for lead free compositions.
IPC and JEDEC also select elite industry experts to present a two-day technical conference covering crucial lead free topics. Presently, Conference Chairs Jean Hebeisen and David Bergman of IPC and John Kelly and Donna McEntire of JEDEC are seeking papers and presentations pertaining to the following areas:
- Policy —European lead ban status
- EMS Industry — On the front line of the change
- Component issues (passives and actives)
- Design issues
- Environmental health and safety effects and alternatives
- PCB issues
- OEM/Consumer demands/voluntary elimination dates
- Recycling options
- Substitution — New commercially available alloys/conductive adhesives/ease of replacement
- Cost issues
- Reliability evaluations (e.g., temperature cycling data, tin whiskers)
- Roadblocks to implementation
- Finishes issues — Organic solder protectants, immersion tin, silver, electroless nickel, palladium, etc.
- Lead-free and other product sectors (automotive, aerospace, etc.)
Each International Conference on Lead-free Electronic Components and Assemblies will offer 30- to 45-minute time slots for papers and presentations in both forum or panel discussion formats. Presentation materials and papers should be noncommercial in nature, focusing on technology. To deliver an oral presentation, it is mandatory to provide a print-quality paper or hard copies of visuals for the conference proceedings. Previously published papers and papers focused on a company's products will not be accepted.Abstracts summarizing original and previously unpublished work and covering case histories, research and discoveries should be approximately 200 to 300 words long and include a brief biography. The deadlines for abstract submissions are as follows:
- San Jose — January 23, 2004
- Singapore — May 28, 2004
- Frankfurt — July 30, 2004
If an abstract is accepted, paper submissions must be received by:
- San Jose — February 27, 2004
- Singapore — July 23, 2004
- Frankfurt — September 24, 2004
Top PCB suppliers also are welcome to showcase their products and services at the conference.
JEDEC is the world's leading standards development organization for the semiconductor industry. Eighteen hundred representatives of some 275-member companies actively participate on 50 committees, developing standards to meet the needs of every segment of the industry. For more information, visit www.ipc.org.