New Products
December 31, 1969 |Estimated reading time: 6 minutes
Semiautomatic Screen Printers
The Viking-class Horizon 05 platform of semiautomatic screen printers reportedly features fully automatic vision alignment, the company's adjustable stencil mount and extensive networking capabilities. The machines accept stencils up to 29 × 29", and can be upgraded to pass-thru capability as requirements evolve. Built on the Horizon chassis, the new printers achieve stencil-board repeatability of 1.33 Cpk at ±25 µm, while software-controlled programmable lighting is said to enhance the accuracy of visual inspection routines, and enables faster fiducial alignment. The platform also includes on-board diagnostics that allow the user to access system-level modules, exercise major components, and perform other troubleshooting and maintenance tasks. DEK International GmbH, Zurich, Switzerland.
Spray Fluxing System
The Performa spray fluxing system is said to increase wavesolder process yields. This improvement in yields allows improved profitability of the assembly process. The system reportedly is maintenance-free, with an electronic drive to traverse the Ultra-Spray ultrasonic head and a precision gear pump for flux delivery. The electronic drive synchronizes the motion of the spray head with the conveyor speed and board width to ensure that uniform flux deposition with complete through-hole penetration is obtained for every board. Additionally, the head traverses to the exact width of the board to optimize throughput and coverage. Manual adjustments are not required because all setup parameters are controlled electronically. The operator interface can store hundreds of recipes, and all parameters are password-protected. Ultrasonic Systems Inc., Haverhill, Mass.
Dual-mode Inspection System
The combination of automated optical inspection (AOI) and boundary scan test technologies reportedly has been enhanced for use in an in-line production environment. The amalgamation of two key test technologies in a single system is said to allow for the detection of faults that cannot be identified by AOI alone. Particularly, the system is capable of testing hidden solder joints on complex components such as BGAs. The combined system consists of the company's boundary scan software and hardware integrated into their OptiCon AdvancedLine and SpeedLine in-line AOI systems. A universal contactor reportedly connects power supplies and the JTAG bus to the unit under test in an in-line process. GOEPEL electronic GmbH, Jena, Germany.
Board Stacking Connector
SMT board stacking connector surface mounts to both the bottom and the top of a PCB. Using capillary action, the connector is said to provide good solder joint strength and thus a more reliable connection than through-hole pins. The connectors are self-centering and offer coplanarity within 0.001", eliminating alignment problems. They use minimal real estate, reportedly allowing additional components to be placed on the PCB and providing design flexibility. Additionally, they have low contact resistance and a high current rating to meet today's modular power requirements. The connectors are available in bulk, on pallets or on SMT tape. Zierick Manufacturing Corp., Mt. Kisco, N.Y.
ASSEMBLY TOOLS/EQUIPMENT
Flat Belt Conveyor
A modular transport solution, Genesis Series F3000 flat belt conveyor can be configured to meet specific user requirements. With the ability to transport PCBs and pallets, this module can be used to incline/decline products from a wavesoldering system using an optional high-temperature ESD belt. The module also can be fitted with a full array of workstation options, which allows the module to function as an ergonomic workstation. Standard features are said to include CE compliance with an ESD-safe design, DC speed controller, ESD-safe belting, a maximum temperature of 80°C, and adjustable belt tension. Options reportedly include a PLC control package with indexing software, including both visual and audible alarms; cooling fans; belt widths of 305, 457 and 610 mm, including nonstandard belt widths; module lengths from 24 to 300"; a high-temperature ESD belt up to 121°C; and more. FlexLink Inc., Bethlehem, Pa.
PICK & PLACE
Dip-flux Feeder
The Dip-Flux Feeder reportedly facilitates flip chip assembly by accurately and precisely fluxing flip chips and other component types prior to placement. The feeder picks up a component from a waffle tray, stick feeder or tape feeder, then dips the component, leads or BGA balls into the rotating flux bath. It then places the component or flip chip onto the board or substrate. The high accuracy of the system is said to enable it to pick pre-flipped flip chips. Component wetting occurs through precisely controlled movement and materials control that ensures repeatability. A fixed squeegee in a rotating flux bath ensures constant flux wave height. Additionally, laser sensors detect approaching components and halt squeegee rotation for the duration of the dipping process. MIMOT, Irvine, Calif.
REWORK/REPAIR
Vision Rework Station
INDEPENDENCE vision rework station is targeted for use by low-volume users who need BGA and fine-pitch placement capability. The system includes a reflow head ..with 2.5" of Z-axis travel, a digital controller with all four modes of operation, a Sniper vision placement system in manual configuration, a 13" color display, a free-standing 8 × 12" frame holder with Teflon-coated base, and a self-contained vacuum IC removal device. This system is the first of four new vision rework stations the company plans to release this year. APE Corp., Key Largo, Fla.
SCREEN PRINTING
Big Board Printer
This company launched the Big Board version of its flagship MPM UltraFlex printer, capable of printing 24 × 36" boards that weigh up to 70 lb. The printer also can handle smaller boards (4 × 6" minimum), giving customers the option to use the machine for more conventional print requirements. The upgraded printer reportedly features a heavy motorized construction and strengthened centernest to allow it to handle assemblies up to 70 lb., which is said to be three times the capacity of competitive systems. Additionally, the printer is said to have a proprietary 90° rotation mechanism, allowing it to print large boards using standard 29" wide stencils. It also uses standard squeegee blades up to 24" wide, even for the largest panels. This feature allows boards to be printed perpendicular to the board's shortest dimension, limiting squeegee blade length and delivering consistent prints across the board. Speedline Technologies Inc., Franklin, Mass.
SMT MATERIALS
Anti-tombstoning Solder Paste
A no-clean solder paste, Multicore 63S4 MP200 is formulated with the 63S4 alloy that reportedly eliminates costly tombstone defects and reduces component misalignment that occurs when reflowing boards with small components. The paste also offers good performance on difficult-to-solder substrates. Suitable for fine-pitch, high-speed printing applications, the material is a drop-in replacement for standard lead alloys, but offers a wider process window to compensate for inaccuracies in screen printing, pick-and-place, and thermal profiling. The paste is said to be formulated to deliver extended abandon time, long open time, slump resistance and increased tack life. It also is suitable for use on various substrates including HASL, OSP copper, gold over nickel and silver immersion. Henkel Loctite Corp., Industry, Calif.
SOLDERING EQUIPMENT
Lead-free Soldering
RO400-FC uses a full convection to heat PCBs with even temperatures, and reportedly allows soldering of complex boards as well as new component technologies that require a well-controlled soldering process. ..The rectangular, laminar airflow offers an efficient heat transfer and makes it possible to work with lead-free solders. The difference between the air temperature and the solder temperature is said to be small, and the heat load is minimized. Additionally, local hot spots or shadow effects cannot occur because the heat is spread evenly into all components, independent of color or size. The temperatures of the five heating zones and the conveyor speeds are programmable according to the desired soldering profile. Temperatures are regulated within the air stream, just at the height of the PCBs. ESSEMTEC AG, Aesch/LU Switzerland.