2003 IPC Designers Learning Symposiums Take Shape

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Northbrook, Ill. — The IPC Designers Council announces the schedules for its two Designers Learning Symposiums in 2003, taking place October 6 through 8 at the Holiday Inn Montreal Aeroport in Montreal, Quebec, Canada, and November 11 through 13 at the Marriott at Research Triangle Park in Raleigh, N.C.

Each symposium will offer seven workshops on the necessary skills that printed circuit board (PCB) designers and others involved in engineering or manufacturing along the electronics manufacturing supply chain can immediately apply. ighlights of this year's workshops include:

  • Embedded Component Design: A Hands-on Experience In this course, Michael Fitts, Mentor Graphics, will guide participants through an interactive embedded component design tutorial to examine the impact that embedded components will have in reducing company costs. Fitts also will provide the necessary techniques to implement various technologies at the printed circuit board level.
  • Fundamentals of High-Speed Digital Design This hands-on workshop will non-mathematically introduce signal integrity for the high-speed digital design space and focus on real-world solutions to these issues. Attendees will experiment with practical ways of dealing with high-speed phenomena through hands-on labs.
  • Next Generation Interconnections: Photonics and Beyond Happy Holden, Westwood Associates, will analyze optoelectronics and photonics: the next generation of signal interconnections for ASIC packaging, portable products, high-performance computing and telecom. He will also discuss the engineering challenges, electrical performance and signal integrity issues involved in electronics.
  • PCB Design for RF Applications (Raleigh Symposium only) This course will present a practical guide to the many RF design issues facing the modern PCB designer, including the basic RF concepts of wavelength, frequency spectrum, modulation, power measurement and capacitance, inductance, resonance and impedance. Andy Kowalewski, SyChip, will also review the problems and solutions of laminate selection, stack-up planning and impedance control.

Other workshops will cover "Process Considerations in the Assembly and Design of BGAs" by Rodney Miller, Tri-Onics; "Thermal Management and Conductor Current-Carrying Capacity in Printed Circuits" by Michael Jouppi, Thermal Man Inc.; "Challenges in Bare Die Mounting" by Larry Gilg, Dynalog Systems Inc.; and exclusively at the Montreal Symposium, "Pad Stack Design and PCB Stack-Up Generation for High Yields" by Lee Ritchey, Speeding Edge.

Also at the Designers Learning Symposiums, Gary Ferrari, Ferrari Technical Services, will lead both a free Self Development Forum and a Design for Manufacture Off-Site Applied Training segment. The former will prepare today's PCB designer to better market themselves on paper and within their workplace. The interactive, half-day applied training workshop will be held at a leading Interconnect Manufacturing Service/PCB company. Through multiple lectures, a panel discussion and a facility tour, PCB designers will gain a better understanding of the design philosophy for manufacturability by directly observing the processes, smelling the chemistries and touching the end product.

Additionally, the Symposiums will offer a technical conference, with papers and presentations dealing with the industry's hottest topics, as well as a roundtable discussion on "What You Need to Know about Embedded Passives Technology to Keep Your Company Competitive," hosted by IPC's new Technology Subcommittee and the IPC Designers Council.

Designers who aspire to become Certified Interconnect Designers (CID) and Advanced Certified Interconnect Designers (CID+) will also be able to participate in the IPC Designer's Council Designer Certification programs that follow both Designers Learning Symposiums. Developed to assess one's knowledge of how to transform a schematic into a reliable rigid PCB design that can be easily manufactured, assembled and tested, these certification classes are based on several critical IPC documents that link design principles to the end product use of the printed wiring assembly.

The IPC Designers Council is a professional society of designers forming an international network. Its mission is to promote printed board and printed board assembly design as a profession and to encourage, facilitate and promote the exchange of information and integration of new design concepts through communications, seminars, workshops and professional certification through a network of local chapters.

IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,200 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.



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