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Speaking of this Week — August 15, 2003
December 31, 1969 |Estimated reading time: 2 minutes
By Christine F. Della Monaca
Speaking of this Week reflects on events in the electronics assembly industry every Friday.
The focus this week is on people, with personnel news, including some from within SMT, from a multitude of companies. Also appearing this week is companies coming together, tradeshow news, progress and an industry metric. Read all about it:
- First, lots of people getting appointed, promoted or hired, generally a good sign: Suzanne Craven has become the new western regional sales manager for both SMT and Advanced Packaging magazines. Meanwhile, Flemington, N.J.-based DEK named Neil MacRaild as general manager for Process Support Products (PSP) in the Americas, and Malvern, Pa.-based Vishay Intertechnology Inc. promoted Glyndwr Smith to executive vice president. Over at Greenville, S.C.-based KEMET Corp., David E. Gable will assume the role of vice president and chief financial officer on September 1, when Ray Cash, currently in that role, retires. Finally, Lake Success, N.Y.-based Park Electrochemical Corp. elected Murray O. Stamer as CFO and senior vice president.
- In companies coming together news, Londonderry, N.H.-based Cookson Electronics Inc. will enter into a license agreement with Coshocton, Ohio-based GE Electromaterials. Denmark-based EMS provider bb electronics purchased a MSD control system from Quebec, Canada-based Cogiscan, while Medfield, Mass.-based Milara Inc. appointed Technology Resources Corp. (TRC) as a manufacturer's representative for Florida and Puerto Rico. Finally, Boston-based Teradyne Inc.'s Assembly Test Division has been awarded a five-year contract by the U.S. government's General Services Administration (GSA), which covers five product lines.
- The onslaught of trade shows continues: Des Plaines, Ill.-based Northrop Grumman Corp. announced that Kester's David Torp has written a paper on lead-free soldering material interactions, to be presented by Product Manager Fritz Boyle at Northbrook, Ill.-based IPC — Association Connecting Electronics Industries' Making the Leap to Lead-free conference, taking place next week in Longmont, Colo. In the online world, the Arlington, Va.-based trade organization Electronics Components, Assemblies & Materials Association (ECA) has launched virtual trade shows on its Resource Central Web site. In other IPC news, the association announced the very ambitious schedule for its fall Technology Market Research Council (TMRC) meeting in early October, taking place in Minneapolis. IPC also announced the creation of the National Conference on Electronic Packaging for Homeland Security, taking place in Gaithersburg, Md. in mid-October.
- IPC also has progress news this week: Its Solder Products Value Council (SPVC) released a white paper report on the round robin test program on the assembly properties of three lead-free solder alloys. In other progress news, DEK reports it has seen sales figures in Asia-Pacific, Europe and the Americas showing month-on-month growth in unit sales for the first half of 2003, broadly hinting at a market return. QTS Inc. relocated its headquarters from East Walpole to Medfield, Mass., while Stratham, N.H.-based Vitronics Soltec shipped its 1,000th XPM Series convection reflow system. Finally, Westbury, N.Y.-based Sprague-Goodman Electronics announces that its current inventory is available online.
- Things are looking...steady, according to ECA, who says that electronic component orders kept the pace in July, but may be in line to order more soon.
This just in: According to this week's Quick Vote, half of you router to depanel PCBs, while the rest of you hand break, saw or punch, in descending order.
Have some insight on the industry? See something you don't agree with? Think I'm right on? Send it all to me at mailto:christinef@pennwell.com.