Kester Paper to be Presented at Conference on Lead-free Electronics

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Des Plaines, Ill. — Northrop Grumman Corp. announces that Kester's Vice President of Marketing and Business Development, David Torp has written a key paper that Product Manager Fritz Byle will present at the upcoming "Making the Leap to Lead-free" conference on lead-free electronics, co-sponsored by IPC — Association Connecting Electronics Industries and Maxtor Colorado Corp.,

"Making the Leap to Lead-free" is dedicated to U.S. electronics companies who are making the switch to lead-free, and is scheduled to take place August 19 through 20, 2003, in Longmont, Colo. The educational program will be featured on Tuesday, August 19, and the technical conference will follow on Wednesday, August 20.

The event will elaborate on the status of U.S. legislation and what it will mean for the electronics industry. Participants will have the opportunity to hear directly from industry experts who have taken the first steps into the lead-free world and find out the challenges they have overcome as well as key benefits they have received.

Torp's paper, which will be presented by Byle, will take place at 9:30 a.m. on Wednesday, August 20, during the Technical Conference and will discuss "An Investigation of Lead-free Soldering Materials Interactions for Multiple Soldering Operations."

Kester is a world-renowned supplier of solder and related materials and services to the electronics assembly, micro-component, industrial soldering, hardware/retail and wholesale plumbing markets. For more information, visit



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