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IPC Updates Two Test Documents
May 15, 2003 |Estimated reading time: 1 minute
Northbrook, Ill. — IPC — Association Connecting Electronics Industries announces the release of two newly revised standards on solderability, IPC/EIA/JEDEC J-STD-002B, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, and IPC/EIA J-STD-003A, Solderability Tests for Printed Boards.
The ANSI-approved IPC/EIA/JEDEC J-STD-002B provides the necessary methods to assess the solderability of electronic component leads, terminations, solid wire, stranded wire, lugs and tabs. This revision includes a significant change in the type of flux required for solderability testing. The 34-page standard, which supersedes J-STD-002A, also contains several test method options, defect definitions, acceptance criteria and illustrations. It is suitable for use by both suppliers and users.
The 26-page IPC/EIA J-STD-003A supplies industry-recommended test methods, defect definitions and illustrations in order for suppliers and users to assess the solderability of printed board surface conductors, lands and plated through-holes. This revision also includes a significant change in the type of flux required for solderability testing. Test methods covered in IPC/EIA J-STD-003A include edge dip, rotary dip, solder float, wave solder and wetting balance. This new version supersedes J-STD-003.
IPC's Online Store houses a vast library of IPC products, including more than 1,000 standards, publications and training sources on electronics assembly, circuit board fabrication and design; more than 440 technical papers submitted at IPCWorks, IPC Annual Meeting, IPC Printed Circuits Expo and IPC SMEMA Council's APEX technical conferences; and more than 4,000 downloadable technical graphic images.
IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.