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Northbrook, Ill. -- IPC -- Association Connecting Electronics Industries and the Die Products Consortium (DPC) will co-sponsor a free online conference on the current state of bare die packaging.
The 30-minute presentation will take place Friday, May 16, 2003, at 11 a.m., Central Standard Time (CST).
With consumer and telecom markets driving the microelectronics industry to produce smaller and more powerful products, only those solutions that incorporate bare die, flip chip and wafer level packaged ICs will offer the most significant size, performance, time to market and system cost advantages.
The free web conference, entitled "Next Generation Bare Die Packaging," will explain how advanced packaging approaches can provide leading edge solutions, while still allowing the flexibility to respond to changes in market demand and product differentiation. The presentation will also dispel the myths of known good die (KGD) and identify the tools required to be successful in the world of packaging innovation.
Topics covered in this seminar include:
- PCB design, fabrication and assembly to support die products
- Supply strategies for bare die, flip chip and wafer level CSP
- EMS-friendly die products
- Standardization priorities
- Total cost of ownership consideration
- How to integrate bare die into a surface mount line
The Die Products Consortium is a collaborative effort by a group of microelectronics companies to enlarge the worldwide market for die products. Members of the consortium have been active in promoting the use of die products for more than 10 years. Current members include Agilent Technologies, Analog Devices, August Technology, Chip Supply, IBM, Intel, LSI Logic, Motorola, National Semiconductor, Samsung Electronics and Texas Instruments.IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.