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Advanced Interconnect Technologies Consolidates, Expands Assembly and Test Operations in Indonesia
April 15, 2003 |Estimated reading time: 1 minute
Pleasanton, Calif. -- Advanced Interconnect Technologies (AIT) will consolidate and expand its assembly and test operations in its factory in Batam, Indonesia.
The move bolsters one of the region's most advanced back-end production and test facilities and will enable AIT customers to streamline operations by leveraging a single location for complete IC subcontract assembly and test services.
As a result of the consolidation, AIT will phase out operations at its Hong Kong assembly and test facility. The closure will be completed by May 9, 2003.
The move creates one of Asia's premier facilities for back-end processes, adding additional advanced packaging and test equipment to existing technology for wafer probe, wafer backgrinding, IC packaging and final test of both leaded and array packages.
AIT plans to add its PBGA line in Batam and also its FBGA line, which will enable AIT to broaden its strategic chip-scale Saw-Singulated Array product offerings for markets with significant forecasted growth. AIT Batam is certified ISO 9001, ISO 14001 and QS 9000. The 370,000 sq ft facility has been recognized by semiconductor manufacturers worldwide for both quality and customer service.
Advanced Interconnect Technologies is a global provider of semiconductor assembly and test services for some of the world's most successful electronics companies. The company's turn-key services include design, assembly, test, failure analysis, and electrical and thermal characterization. For more information, visit www.aitsales.com.