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Northbrook, Ill. -- IPC -- Association Connecting Electronics Industries has planned several complimentary events at IPC Printed Circuits Expo 2003, which takes place March 23 through 27 at the Long Beach Convention Center in Long Beach, Calif.
From the free forums to the free keynote addresses, attendees and exhibitors will be able to discover upcoming technology and examine market trends from respected industry leaders and distinguished experts.
This year, the IPC Printed Circuits Expo 2003 Trade Show Subcommittee has invited Dick Rutan and Walt Custer to deliver the Tuesday and Wednesday morning keynote addresses. Rutan, an aviation expert and former U.S. Air Force Tactical Air Command fighter pilot, will present, "A Global Vision -- Literally," on Tuesday, March 25, from 9 to 10 a.m. In his address, Rutan will share the exhilarating experiences during his nine-day, around-the-world flight in the Voyager airplane.
Then on Wednesday, March 26, from 9 to 10 a.m., Custer, president of Custer Consulting Group, will present "A PCB Market Outlook -- the Ins and Outs." Previously a 24-year employee of Morton Electronic Materials and a longtime authority on all aspects of the PCB industry, Custer will uncover the PCB market trends, analyze business conditions and deliver vital industry data.
The 2003 Trade Show Subcommittee, under the direction of Chairman Fred Floer, Schmid Systems Inc., has also developed nine free forums to take place Tuesday, March 25 through Thursday, March 27.
Highlights of the IPC Printed Circuits Expo 2003 free forum schedule include:
- IPC Process Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database Tuesday, March 25 1:30 to 3 p.m.Chair: David Wolf, Conductor Analysis Technologies Inc.The IPC D-36 Subcommittee has developed an industry standard for process capability test panel designs and the PCQR2 database detailing the capabilities of PCB suppliers. The program provides quantitative data that allows subscribers to statistically benchmark board suppliers' capabilities; perform intelligent sourcing; select new suppliers; ensure design for manufacturability; and establish realistic design rules. The seminar will include in-depth discussions of the test panel designs, analysis reports and the database.
- North American PCB Industry Town Meeting (developed and organized by CircuiTree magazine) Tuesday, March 25 1:30 to 5: p.m.Chair: David Bergman, IPCThis forum will address the reduction in demand for U.S. capacity and what must be done to ensure that the North American industry remains vital. Industry leaders will discuss the state of the industry, technology innovation, R&D funding issues, OEM requirements, small business concerns and global business strategies.
- Underwriters Laboratories Forum: How Do You Deal With Change? Wednesday, March 2610 a.m. to NoonChair: Michael Musich, Underwriters Laboratories Inc.In this session, UL personnel will discuss hot topics, including rigid, flex and new materials considerations; embedded devices; silver conductor materials; long and short term testing; and future developments. Though open to all, this forum is designed for product, R&D and quality engineers from PCB manufacturers and base material and soldermask suppliers whose job functions relate to UL Recognition.
- Hazardous Waste Deregulation: An Open Dialogue with EPAWednesday, March 26 10 a.m. to NoonChair: Bret Bruhn, MerixAn expert panel will discuss EPA plans to change regulations that defineelectroplating wastewater sludge as a RCRA F006 hazardous waste. Current regulatory definitions limit reclamation options and burden the industry with higher costs. David Jones, a key member of the EPA team who is working to change the definition of F006, and industry members familiar with other variance and delisting efforts will make up the panel. This session will provide a rare opportunity to influence EPA regulatory development.
- Embedded Passive Devices: Implement NowWednesday, March 26 1:30 to 3 p.m.Chair: Dennis Fritz, MacDermid Inc.This session will include synopses of papers presented at the March 25, technical session ("Embedded Passive Devices I") and the March 27 presentation ("Embedded Passive Devices II"). The panel discussion will be made up of personnel who are well versed in the concepts behind embedded passives technology.
- National Security and the PCB Industry: An Overview of the Electronic Interconnection Center of Excellence (EICE)Wednesday, March 26 3:15 to 5 p.m.Chair: David Bergman, IPCThrough a joint effort, IPC and NSWC Crane recently established the EICE to help support the military's PCB requirements. The program will conduct manufacturing research and development programs within NSWC Crane's industry and academic facilities; develop solutions to current military problem areas; and evaluate new leading edge design and manufacturing technologies for military and commercial requirements, prior to adoption by PCB manufacturers. This forum will give an overview of the EICE program and highlight the important role the industry must play to ensure its success.
- Fast Track: Reducing Time from Design to MarketThursday, March 27 8 a.m. to NoonChair: N.T. "Bala" Balakrishnan, California Polytechnic University -- PomonaTime to market has become the leading survival tactic for organizations fighting for market dominance in an increasingly competitive environment. This session examines successful strategies that have paid off for companies growing by mergers and acquisitions, and the integration of knowledge databases for products, design specifications, customer and supplier information.
- What Are You Doing to Cut Costs? Benchmarking Environmental, Health and Safety Compliance ExpendituresThursday, March 27 10 a.m. to NoonChair: Lee Wilmot, Tyco Printed Circuit GroupIn this informative forum, a panel of EHS managers from top performing facilities will discuss the secrets behind the cost effective performance of their wastewater treatment, solid and hazardous waste management, water conservation programs and more.
- Base Material RoundtableThursday, March 27 2 to 4 p.m.Chairs: Bernard Kessler, Bernard Kessler & Assoc. Ltd.Doug Sober, Bakelite Epoxy Polymers Corp.This open forum will allow attendees to share ideas, opinions and solutions to the base material problems that face the PCB industry with experts and fellow colleagues. Topics include copper, laminate and resin systems, glass and other reinforcements; what's hot and what's not with HDI and High Frequency designs; and the status of halogen free laminate and exposure to lead free soldering temperatures.
IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,400 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.