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Scharding, Austria and Taipei, Taiwan -- EV Group (EVG) has concluded a multimillion dollar equipment purchase agreement with Asia Pacific Microsystems Inc. (APM)
This order, which has already been shipped and successfully installed forms part of a complete MEMS (micro-electro-mechanical systems) production line. APM is involved in the design and manufacturing of MEMS sensors and wireless communication components and has inaugurated its MEMS wafer foundry on November 19, 2002.
Part of this order are a fully automated EVG620 precision alignment and lithography system, two EVG150 automated resist processing systems, an EVG301 single wafer and mask cleaner, and an EVG560 production wafer bonder for performing most critical steps in microfabrication. Double-side alignment and wafer bonding (anodic, fusion, eutectic) play a significant role throughout the whole MEMS manufacturing processes at APM.
The MEMS sensor fabrication involves several process steps, which the EVG wafer processing systems can manage due to the ability to handle various wafer sizes and materials.
EVG is well recognized in setting technology standards for the MEMS production industry and is known in the market with the longest experience in manufacturing aligned wafer bonding and double side lithography equipment for the MEMS/MST industry.
Asia Pacific Microsystems Inc. (APM) is a professional MEMS IDM corporation specialized in design, development and manufacturing of wireless communication components/modules and MEMS microsensors. For more information, visit www.apmsinc.com.
EV Group (EVG) manufactures a full line of wafer bonders, mask and bond aligners, photoresist coating systems, and cleaners for microelectromechanical systems (MEMS) and semiconductor market segments. For more information, visit www.avgroup.at.