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Framework for International Lead-free Soldering Roadmap Agreed Upon
January 22, 2003 |Estimated reading time: 2 minutes
UK -- An International Framework recommending timescales and actions for achieving coordinated introduction of lead-free soldering processes has been agreed upon.
SOLDERTEC and JEITA (Japan Electronics and Information Technology Industries Association) have established the International Lead-free Soldering Roadmap Framework as a guidance document that is recommended to those in the electronics industry wishing to implement lead-free production processes in a timely manner. The Framework details the recommended timescales for electronic components manufacturers and electronic assemblers to initiate and complete the transition to lead-free, with the aim of developing products that will comply with imminent European legislation. For example, the Framework recommends that component manufacturers should have a complete line-up of lead-free components by the end of 2004. The document also recommends the use of 0.1 percent as a maximum concentration for Pb in "lead-free" products. Lead soldering materials have been widely used in electronics equipment to attach components to circuit boards, in integrated circuits and other electronic components. However, in recent years the environmental impact of lead has come under scrutiny. The transition from use of tin-lead to lead-free solder affects companies on a global basis and any delays in parts of the supply network, or in some regions of the world, can have a serious effect on lead-free implementation as a whole. For the transition of assembly and packaging manufacturers to lead-free, it is necessary for assembly manufacturers to deal with such issues as improving the heat resistance of electronic components and achieving lead-free connections within, and to, these components. For this reason, a harmonized approach is essential. To realize the elimination of lead across the increasingly global electronics supply chain, an internationally promoted initiative is imperative. International cooperation through the Lead-free Soldering Roadmap Framework will ensure an orderly conversion process over the next few years, and SOLDERTEC and JEITA will be pro-actively recommending these international guidelines to industry. The publication of the Framework follows the recent agreement on the EU WEEE (Waste Electrical and Electronic Equipment) and RHS (Restriction of Hazardous Substances in Waste Electrical and Electronic Equipment) Directives. The RHS ban on hazardous materials has been confirmed as July 1, 2006, making lead-free a requirement for any products on sale to European consumers after this date. A phase-out of cadmium, mercury, hexavalent chromium and two types of brominated flame retardants (PBB and PBDE) will also be required. The final voting and approval procedures for WEEE and RHS were successfully completed by both the European Parliament and Council during December 2002, removing any remaining doubt over the certainty of introduction of both pieces of legislation. The Framework document resulted from the 2nd Lead-free Summit meeting held in Tokyo in November. For more information, visit www.lead-free.org or www.jeita.org.