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PCB Market Trends
December 31, 1969 |Estimated reading time: 5 minutes
Diverse and growing, the PCB market changes constantly to keep pace with new technologies and customer demand.
By Keith Robinson
The North American printed circuit board (PCB) market is a diverse market. The accelerated growth of the electronics industry has increased the rate of technology change in this market. The drive for more powerful electronics has given rise to technologies such as multilayer PCBs and high-density interconnection (HDI) techniques. The overall electronics industry's push for small, portable products has led to the development of flexible and rigid-flex PCBs. North American manufacturers tend to be the technology leaders in the PCB industry. Most low-end PCBs are manufactured and purchased by low-cost regions, such as the Pacific Rim, and they are used in mass-produced devices, such as consumer electronic products.
The primary customers for PCBs change constantly. The growth of the electronics manufacturing services (EMS) and original design manufacturing (ODM) industry has altered the electronics landscape. Since EMS providers have begun assembling many of the end products in the electronics industry, they have become a large customer segment for all types of PCBs. In some instances, major EMS providers also are major PCB manufacturers.
It is anticipated that demand from EMS providers will continue growing over the next five years as more OEMs use EMS providers.
Although the short-term outlook seems bleak, long term it appears bright for the world PCB market. It is expected that it will rebound slightly for North America in 2003, while China is expected to maintain positive growth (fueled by telecommunication opportunities). The long-term market also is expected to see increased demand from next-generation wireless telecommunications products. The figure illustrates the percentage breakdown of the North American PCB market by vertical market in 2001.
The PCB market's North American percent of revenue by vertical markets for 2001.
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Single- and Double-layer Rigid PCBs
Single-layer rigid PCBs are the most simple and common type of printed circuit product. The single-layer rigid PCB was the first device used for the interconnection and assembly of electronic components to form a cohesive, functional operating system.
The North American PCB market no longer is focused on single-layer rigid PCBs, and the development of double-layer rigid PCBs has further transformed the electronics industry. The electronics industry always has demanded smaller components. The introduction of double-layer rigid PCBs allowed electronics manufacturers to place components on both sides of the board, thus decreasing the overall space needed for the electronics assembly. Although they naturally lack the performance of current multilayer boards, the double-layer rigid PCB was the forerunner to such boards. Components are attached to the surfaces of multilayer PCBs in much the same way that they are attached to double-layer boards.
HDI, in terms of single- and double-layer boards, also is significant to the future of the PCB industry. Because copper lines on the PCB carry signals to and from components, it makes sense that the more lines that can be placed on a board, the higher performance the board will have. Therefore, by decreasing line width, as well as the spaces between those lines, a manufacturer can increase board performance. Additionally, the manufacturer can decrease a board's overall size without decreasing performance. Manufacturers currently are working to develop procedures that will allow for 0.003" and less lines and spaces on PCB surfaces.
Although drilling holes in boards is not as crucial in single- and double-layer PCBs as it is in multilayer board construction, it remains crucial in mixed-technology boards. In these assemblies, both surface mount and plated through-hole (PTH) technology components are used. PTH components require a hole to be drilled through the board to solder the leads of the component to the opposite side. The drilled hole renders the area around it useless for lines and spaces. Therefore, the smaller the hole, the more area that can be used for lines and spaces. Equipment manufacturers are working diligently to find ways to drill smaller holes. Some PCB manufacturers are experimenting with lasers to drill the holes, but the process is expensive.
Multilayer Rigid PCBs
Several manufacturers that previously focused on single- and double-layer PCBs have switched their focus to manufacturing multilayer boards. Whereas a large amount of the single-/double-layer rigid PCB manufacturing has moved to the Pacific Rim, North American manufacturers continue to be the technological and market leaders in multilayer rigid PCBs. Although some manufacturers recently have begun experiencing limited competition from foreign multilayer rigid PCB manufacturers, the majority of market advancement continues from North America. The high demand for the products make it a lucrative market for all manufacturers capable of producing the complex multilayer boards.
The technology and expense behind manufacturing complex boards holds back some manufacturers from entering the market. The large expense involved in purchasing manufacturing equipment, primarily drilling equipment, is one barrier. The other hurdle is the lack of individuals with the technological expertise required to manufacture microvias. Only a small percentage of North American PCB manufacturers are capable of manufacturing high-quality multilayer rigid PCBs.
Every manufacturer in the multilayer rigid PCB market is concerned about microvias and overall HDI. Because product functionality depends on the interconnection between the layers making up the PCBs, they constantly seek methods to improve the drilling process. Without microvia production improvements, multilayer PCB manufacturers are forced to increase product size to improve performance. The escalating cost of real estate is driving all industries to seek smaller products, lowering the demand for end products that contain thick, high-layer count PCBs.
Flexible PCBs
The introduction and growth of the multilayer flexible printed circuit market in North America has increased the ability of manufacturers of complex electronics products to reduce end product size. Multilayer flexible printed circuits combine the advantages of high-density rigid PCBs with the physical attributes of flexible circuits. Multilayer flexible circuits are gaining in popularity, although they have not yet reached the performance of high-layer count multilayer PCBs. As flexible layers increase, the flexible circuit loses much of its flexibility, and thus, much of their advantage over rigid boards.
Although used in different applications due to different performance or physical requirements, rigid PCBs and flexible printed circuits have much in common. Many of the advantages and disadvantages of multilayer PCBs hold true for multilayer flexible printed circuits. Some shared advantages include high reliability, uniform and accurate wiring, and excellent compatibility with automated machines for easy wiring, component attachment and soldering. Disadvantages that both products share include difficulties in inspection, repair and service. Both products have relatively high initial costs and relatively low recurring costs. However, the overall initial cost of multilayer flexible circuits is much higher than that of multilayer rigid PCBs. As is the case with single-/double-sided flexible printed circuits, the base material used in the construction of multilayer flexible boards is much more expensive than that used for multilayer rigid PCBs.
Keith Robinson may be contacted at Frost & Sullivan, 7750 IH 10 W, Suite 910, San Antonio, TX 70229; (210) 348-1000; Web site: www.frost.com.