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New Products
December 31, 1969 |Estimated reading time: 6 minutes
Inspection SystemC3043 QuickScan inspection system reportedly is designed to handle the majority of standard assembly inspection needs, including recognition of the fault characteristics for paste print, components and wave soldering. This product family is targeted for use in industrial assembly applications, and is equipped with simplified sensors. The heart of the system is a high-resolution line camera with high scanning frequency. The sensor circuitry with software-controlled LED line illumination is said to form the basis for high image quality and stable evaluation, while simultaneously guaranteeing high speed. Viscom USA, Atlanta, Ga.
In-line Drying ModuleOmniJet is an in-line drying module constructed of stainless steal that reportedly uses a high-temperature/high flow air-drying technology. The module removes and evaporates water from the most complex electronics assemblies. This standalone system is designed to replace inefficient drying stages of other in-line drying cleaners. It is said to be SMEMA compatible and also may be integrated into a production line after any in-line cleaner. Stoelting Inc., Kiel, Wis.
Vial ReaderVial Reader 4000 is a high-speed reader of 2-D Data Matrix codes for automated audit tracking of large numbers of vials used in liquid handling. The reader reportedly aids in liquid handling whereby a large number of small vials containing physically indistinguishable liquids must be identified and tracked throughout the analysis, audit and quality control process. Each vial is said to be marked with a Data Matrix code that identifies the individual vials as they are filled and moved to the next stage of the process. RVSI Acuity CiMatrix, Canton, Mass.
Ball Placement SystemThe DirEKt Ball Placement system uses the ProFlow DirEKt Imaging enabling technology. The combination of the patented ProFlow technology with precision stencils and custom-designed solder ball hopper is said to deliver savings in capital investment, process complexity and overall process footprint. The system is said to consist of two machines, the ELA and 265 Horizon systems, side-by-side in the production line. The first machine puts down flux or solder paste using print technology. The second machine features a ball transfer head that positions a solder ball at each pad location. The balls reportedly are gently but firmly pushed down into the receiving material with independent pressure on each sphere. DEK, Flemington, N.J.
FEATURE PRODUCTS
Programming and Optimization SoftwareDimensions Programming and Optimization (DPO) software provides balancing, optimization and program generation for the company's surface mount assembly lines. DPO software reportedly provides one point of data entry, a common interface across machine types, and a consistent process to generate production and setup data for one or more assembly lines, with any combination of GSM platforms, HSP machines or single machines. Universal Instruments Corp., Binghamton, N.Y.
Manual Taping SystemTL-40 manual SMD taping system is designed for low- to mid-volume taping of virtually any type of SMD component. The system is said to accommodate 8 to 56 mm tape with minimal tooling change, and accepts both heat-sealable and pressure-sensitive tapes. TL-40 reportedly incorporates a single-board computer, and the operator uses a keypad to enter the length of the leader, trailer and production run. The system automatically generates the leader and trailer, and ensures that each pocket of the production run contains a part. On-Trak LLC, New Berlin, Wis.
CONTRACT SERVICES
Electronics Manufacturing ServicesThis manufacturer of rack-mounted computers and rack systems is offering EMS on a contract basis to OEMs, making its design and manufacturing facility available for product design, development, fabrication and PCB assembly. For products that already have been designed, the company reportedly can accept essentially any CAD format for direct input into its surface mounting and PCB assembly equipment line. Crystal Group Inc., Hiawatha, Iowa.
Custom Coating ServicesThe company's custom coating segment reportedly provides OEMs, converters and suppliers with turnkey coating services, incorporating customized adhesive development. They reportedly introduced this contracted service to serve as a value-added partnership; customers can reduce overall costs and reportedly leverage the company's expertise in adhesives and coating. By turning the coating process, time- and resource-intensive by nature, over to the company's experts, customers reportedly can gain efficiencies by way of maximized throughput and decreased turnaround time. Tyco Adhesives, Norwood, Mass.
LITERATURE
Component CatalogCatalog 213 features numerous ICs and other electronic components, tools, test equipment and computer products targeted toward OEM and MRO applications within 192 pages. This catalog reportedly is used by thousands of engineers, educators, service/ repair technicians and buyers to source leading edge and hard-to-find components. The company also added more than 275 new products, including ICs, transformers, computer cables, tools, motherboards, connectors, books, converters and power supplies. Jameco Electronics, Belmont, Calif.
LED Solutions Design GuideThe LEDs design book is a 140-page guide for engineers in need of discrete light-emitting diode solutions. This guide reportedly combines the company's SurfeeLEDs design book, which features surface mount LEDs, to present a comprehensive listing of state-of-the-art LED industry design solutions. The four major categories of discrete LEDs are said to include bare-leaded LEDs, PCB indicators, panel indicators and LED arrays. Also described is a wide range of products from basic two-leaded LEDs to intricate chip-on-board devices with more than 100 LED chips. Lumex Inc., Palatine, Ill.
SMT MATERIALS
Encapsulant50500-1 one-component, low-stress epoxy-based "fill" encapsulant reportedly features a glob top, which requires no mixing before use, targeting the encapsulant for use in protecting wire bonded bare ICs where the number and density of wire bonds require an easy flowing encapsulant. When combined with 50300 HT, an epoxy-based "dam" encapsulant, the epoxy is said to deliver low stress protection to electronic components against thermal and mechanical shock. The material is designed for temperature cycling ranges from -65° to 150°C. Emerson & Cuming, Billerica, Mass.
AdhesiveType 6 high-temperature stencil adhesive is for joining foil to polyester mesh on Etch Guard stencils. The raw materials in the adhesive reportedly are designed to withstand newer cleaning chemistries and environments. The adhesive is said to be available on both chemically etched and laser-cut stencils. MicroScreen, South Bend, Ind.
SOLDERING MATERIALS
Hot Air Leveling FluxFLO RITE 300 is a medium-viscosity, water-soluble flux for general hot air leveling needs. The flux is said to have solid activation levels and good wetting for complete solder coverage, and leaves no residues on solder masks. RBP Chemical Technology, Milwaukee, Wis.
Wafer Bumping StencilsPrecision stencils are for use in wafer bump packaging. The mirror-finished stencils are said to feature smooth, nearly trapezoidal apertures, ensuring optimum solder paste release. The stencils reportedly are developed using the electroforming process, which is said to deliver tight tolerances. Designs may be submitted as CAD files in Gerber (RS274X), GWK, DPB and IIPGL formats. Tecan Components Ltd., Dorset, England.
Flip Chip Bump AlloyLF-2 lead-free Sn/Ag/Cu alloy achieves alpha emissions of less than 0.0002 particles/hour/cm2, and is said to demonstrate increased reliability and enhanced effectiveness of under bump metallurgy during high-temperature storage, high-temperature operating life (HTOL), die shear and aging tests. The HTOL test further demonstrates electromigration improved more than 3.7 times vs. 63Sn/Pb and more than four times compared to Sn/Ag plated bumps. Kulicke & Soffa Industries Inc., Willow Grove, Pa.
TEST EQUIPMENT
Test and Taping MachineMP-PLUNGE tube- or bulk-to-test and tape machine is suited for mid-volume input from tube- or bulk-to-tape applications requiring plunge-to-board test capability. The system reportedly achieves throughputs up to 3,600 pph, and its integrated processes include vision inspection, electrical test and taping with optional laser mark capabilities. The machine is said to be RF-compatible and interfaces with most standard testers. Rejected parts are sorted automatically and placed into three to five output bins. Ismeca USA Inc., Vista, Calif.
Multi-range Tester98280 multi-range tester tests ESD control personal grounding items and has three ranges to test wrist straps, dissipative shoes and foot grounders. The tester reportedly has a fast response time to detect intermittent failures, and operates on 100 to 240 V AC. Visual indicator lights verify the outlet's polarity and ground integrity. The unit is said to feature a 30 V DC test voltage. Desco Charleswater, Chino, Calif.