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Flomerics, Harvard Thermal Announce Collaboration on Thermal Models of Electronic Components
December 20, 2002 |Estimated reading time: 1 minute
Southborough and Harvard, Mass. -- Flomerics Inc. and Harvard Thermal Inc. will work together to develop and enhance software tools and standards for thermal modeling of electronic components.
Both companies share the goal to provide the electronics industry with accurate, validated thermal models of electronic components that can be produced quickly and easily, stored in a central Web-based database, and used in thermal analysis software tools such as Flotherm and TASPCB.
The Web-based Flopack software, launched by Flomerics in 1998, has become the recognized standard for rapid generation of thermal models for IC packages. Flomerics and Harvard Thermal will now combine their expertise and resources to accelerate development of the Flopack software. In parallel, Flomerics and Harvard Thermal are working with the JEDEC JC15.1 committee in the U.S. to develop software-independent standards for producing thermal models of IC packages.
Planned future enhancements to the Flopack software include:
- Definition of a standard export format, conforming with the new JEDEC standards outlined above, to allow export of thermal models not only to Flotherm, but also to Harvard Thermal's TASPCB, and other software tools such as ANSYS, NASTRAN and FEMAP.
- A Web-based Library manager, creating a central area on the Internet where component manufacturers can upload and maintain thermal models of their parts, and where end-users can browse and download the thermal models they require.
- Enhancing the "Corporate Workgroups" features to facilitate model-sharing within organizations.
- Continuing expansion of IC package types to include System-in-Chip and optoelectronics components.
- Extension from steady-state to transient models. This is important because often it is the thermal behavior of IC packages while heating up and cooling down which creates reliability problems.
- Direct import of CAD geometry for complex package elements such as leadframes and substrates.
- Thermal solver enhancements, including a pre-conditioned conjugate-gradient solver that can handle temperature-dependent orthotropic properties.
Flomerics Inc. has been the worldwide market leader in delivering software and support services for thermal analysis of electronics since 1989. For more information, visit www.flomerics.com.
Harvard Thermal Inc. has marketed thermal modeling software since 1993. For more information, visit www.harvardthermal.com.