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Japanese Wafer Manufacturers Produce with SOI Wafer Production Bonding System from EFG
December 9, 2002 |Estimated reading time: Less than a minute
Scharding, Austria -- EV Group (EVG) has shipped and installed several EVG850 automated SOI wafer bonding systems at key manufacturing companies in Japan, which wish to remain unnamed.
Among these recent orders are several 200mm production systems and a 300mm SOI bonding system. Today's advanced semiconductor technologies rely on SOI wafers to manufacture leading edge, low-power products for portable electronic devices in consumer and communications applications.
SOI technology has a tremendous potential to improve the functions of electronic products, and the EVG850 reportedly plays a major role in this by producing the quality SOI substrate material required for advanced chip production. SOI wafers are a new advanced chip making material and essential for the integration of multiple high-performance functions on one single chip. The EVG850 incorporates the latest technology and is designed to operate in high-throughput production environments. It has been the qualified production tool in the SOI market for many years and integrates EVG's long-term experience in developing precision wafer bonding systems.
EV Group (EVG) manufactures a full line of wafer bonders, mask and bond aligners, photoresist coating systems, and cleaners for microelectromechanical systems (MEMS) and semiconductor market segments. For more information, visit www.evgroup.com.