New Products
December 31, 1969 |Estimated reading time: 4 minutes
COMPONENTS
Copper Pin Fin Heat SinkUltraCool IV pin fin heat sink reportedly provides exceptional thermal performance. The heat sinks are designed to cool SMDs dissipating high and relatively high loads of heat. They reportedly produce substantial cooling power due to an efficient pin fin structure, as well as the use of highly conductive copper. The pin fin structure is said to provide a large surface area and optimal usage of available airflows. Additionally, these heat sinks range from a footprint of 0.25 x 0.25" to 1.5 x 1.5" and from an overall height of 0.15 to 0.8". Cool Innovations Inc., Concord, Ontario, Canada.
Vertical Female ConnectorsThe 8072 Series of 2 mm hard metric vertical female connectors reportedly are for backplane applications, and comply with international standard IEC 61076-4-101. The connectors are said to eliminate the possibility of bent pins when used in place of male connectors in backplane applications. Press-fit contacts also are provided for a gas-tight connection. AVX Corp., Connector Div., Myrtle Beach, S.C.
CONTRACT SERVICES
Component Assembly ServicesThis company offers light assembly of sensitive electronic components and services such as precision potting, encapsulation and casting. The company is adding staff, equipment and space because it reportedly is experiencing a rapid increase in the custom services side of its business. Capabilities include designing fixtures, and recommending and formulating materials. appli-tec Inc., Haverhill, Mass.
Conformal Coating ServicesHumiSeal conformal coating services are said to protect virtually any printed circuit assembly from contamination. These conformal coatings reportedly provide a secure envelope around a circuit board and its components, and act as a barrier against moisture, fungus, dust and other environmental contaminants. When the coatings are applied properly, they also can enhance circuit reliability by eliminating detrimental conditions such as leakage from high-impedance circuits, and allowing closer circuit traces required with high component density. Chase EMS Group, West Bridgewater, Mass.
REWORK & REPAIR
Precision Rework StationX-1 precision rework station reportedly is a flexible system designed for manual alignment and placement or removal of surface mount electronic components with precisely controlled solder reflow profiles. The system also features a gantry style construction ..similar to that of a pick-and-place machine, allow-ing the board to remain stationary while the head moves to accomplish the X, Y, Z and theta alignment. The design is said to allow a larger board capacity in a smaller footprint with board fixturing, stationary bottom-side support, a large preheater, and a top and bottom board clearance. Precision Manufacturing Tools, A Prodev Inc. Div., Newburyport, Mass.
Array Package Rework SystemAPR-5000 array package rework system is said to offer the repeatability, accuracy and thermal control essential for the safe and effective rework of BGA, CSP, LGA, microSMD, MLF and bumped chip component packages. Capable of handling boards up to 9 x 10" with placement accuracy to 0.001" and interconnection pitches as low as 0.012", the rework system reportedly is targeted for reworking smaller PCBs such as cell phones and laptop computers. Metcal Inc., Menlo Park, Calif.
SCREEN PRINTING
In-line Stencil PrinterE5-36 is a large format in-line stencil printer that features a print area of 36 x 24". The automatic printer offers other features such as a patented vision alignment system with software controlled variable lighting technology, 2 1/2D post-print inspection and vacuum stencil wiping. When processing large PCBs, these features, combined with a heavy-duty transport system, reportedly allow for the same repeatability and robustness performance levels as when printing smaller substrates. EKRA America, Marlborough, Mass.
SMT MATERIALS
Solder Reflow EncapsulantHYSOL FP4470 is a low-viscosity, high-flow, self-leveling fill material that flows quickly, penetrating and covering fine-pitched wires. The encapsulant reportedly is designed to withstand 260°C peak solder reflow temperatures without degradation, and also is formulated to offer low ionic content for good corrosion resistance and to protect large semiconductor devices or devices using lead-free solder. Frozen storage is required at approximately -40°C for maximum shelf life and recommended cure time is 30 minutes at 125°C plus 90 minutes at 165°C. Henkel Loctite Corp., Rocky Hill, Conn.
No-clean Solder PasteA no-clean solder paste made with synthetic poly adducts, SynTECH reportedly yields reliable solder joints in PCB assemblies. The paste offers up to 18 hours of stencil life and is said to be ideal for fine-pitch solder joint ICT. It remains soft and pliable, enabling test probes to pass through flux into the solder joint without clogging the probe. Additionally, the paste reportedly works with all lead-free formulations including tin/silver copper alloys, without compromising SIR values. AMTECH Inc., Branford, Conn.
Epoxy AdhesiveEPO-TEK H20E epoxy adhesive can achieve a thermal conductivity of 29 W/m°K. This high thermal conductivity is expected to be of particular benefit to manufacturers who produce high-density packages and other high-power generating applications. The epoxy reportedly is compatible with numerous substrates such as FR4, ceramics, lead frames, and flex substrates, including Kapton, Mylar and polyester. Epoxy Technology Inc., Billerica, Mass.
SOLDERING EQUIPMENT
Bonding SystemB-3100 Series bonding system is a benchtop, constant-heat bonder designed for joining ..heat seal connectors to LCD, PCB or other substrates. The bonding system is said to feature multiple configurations, including models with a no-motion table, manual Y-axis slide, manual rotary table and pneumatic rotary table. As a standard feature, each system reportedly contains a precision-machined bonding head, encasing a 3" long, 400 W cartridge. Heater bars can be configured up to 3" (76 mm). MicroJoin Inc., Poway, Calif.
Squeegee BladesThe Stainless Steel Urethane Squeegee (SUS) consists of both urethane and stainless steel. The squeegee combines the advantages of both materials in a single bonded blade. Reportedly, only the metal tip of the blade contacts the stencil and this results in the desired sharp print profiles. The blade's hybrid nature is said to eliminate the scooping effect associated with normal urethane blades but lends enough backup and softness to reduce wear on stencil and squeegee (sheer forces). MINAMI America Inc., Torrance, Calif.