-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC, JEDEC Team Up for Lead-Free Conference Sequel
November 1, 2002 |Estimated reading time: 1 minute
Northbrook, Ill. -- IPC -- Association Connecting Electronics Industries(r) and JEDEC, the solid state technology association, have developed the Second International Conference on Lead-Free Electronic Components and Assemblies.
The co-sponsored event will take place December 9 through 12, 2002, at the Grand Hyatt in Taipei, Taiwan.
David Bergman, IPC vice president of standards, technology and international relations, representing IPC, and Martin Freedman, representing JEDEC, will co-chair the conference program, which has collected speakers from around the world to discuss a multitude of lead-free issues, including:
- Lead-Free Interconnect Technical Issues and Soldering Technology
- Lead-Free Tin Alloys
- Tin Whisker Formation
- Lead-Free Motherboard Assembly
- Lead-Free Package Reliability
- EPA/Industry Design for the Environment Program
- IPC and JEDEC's Lead-Free Positions
- Status of Lead Free in the U.S.
The Lead-Free Conference will also offer three educational courses on Monday, December 9, including one tutorial course and two workshops.
John H. Lau, Agilent Technologies Inc., will present the tutorial course entitled "Electronics Manufacturing with Lead-Free, Halogen-Free and Conductive Adhesive Materials." Lau's discussion will cover the fundamental principles, engineering data and cutting-edge information on the most important developments and latest research results that will allow the application of lead-free, halogen-free and conductive-adhesives technologies.
Jennie Hwang, Ph.D., H-Technologies Group Inc., will present both workshops. The first session, "Lead-Free Interconnections: Technology, Selection and Applications," will introduce lead-free solders from application perspectives and present selection criteria for lead-free compositions. The second, "Lead-Free Printed Circuit Board (PCB) Surface Finish and Component Coating," will discuss the important factors that determine the solderability and performance of lead-free surface finishes and component coatings from both chemical and metallurgical aspects. The session will include a review of the material and process options and an examination of the pros and cons of various material/process systems from manufacturing perspectives.
Top PCB suppliers will also be showcasing their new products and services at the Second International Conference on Lead-Free Electronic Components and Assemblies.
JEDEC is the world's leading standards development organization for the semiconductor industry. For more information, visit www.jedec.org.IPC is a U.S.-based trade association dedicated to the competitive excellence and financial success of its more than 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. For more information, visit www.ipc.org.