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ESEC Intensifies Focus on Core Business
October 16, 2002 |Estimated reading time: Less than a minute
Cham, Switzerland -- ESEC is intensifying measures introduced last year towards focusing the company's efforts on its two core business segments, die attach and wire bonding.
Additional means for increasing efficiency are being initiated, and will result in a further global reduction of approximately 60 jobs.
This reorientation of ESEC's business activities and the related concentration on core competencies are showing good results. In the first half of 2002, ESEC was able to strengthen its market position despite the difficult business environment, registering market share gains in both of its core areas of business activity. Moreover, the company has expanded its leading position with regard to technological innovation, sharpened its customer focus and structured its manufacturing processes more efficiently.
ESEC provides chip assembly equipment and processing techniques for use in the semiconductor industry. For more information, visit www.esec.com.