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IMAPS Announces Award Winners for Exceptional Papers at IMAPS 2002
October 2, 2002 |Estimated reading time: 1 minute
Washington, D.C. -- The International Microelectronics and Packaging Society (IMAPS) announces the award winners among the exceptional papers presented at the recent IMAPS 2002 annual symposium in Denver, Colo.
These cash awards are awarded annually, and are based on technical content, originality and applicability to current issues. The IMAPS Technical Committee chooses the award winners based upon evaluations submitted by the members of the Technical Subcommittees and the Symposium Session Chairs.
Best Paper of the Symposium Award: IMAPS offers a cash award of $2,000 for the Best Paper of the Symposium. The winner for this year is "Reliability of Small BGAs in the Automotive Environment", authored by Jeffrey Suhling, R. Wayne Johnson, John L. Evans, Nokibul Islam, Jing Liu, Shyam Gale, Auburn University; and James R. Thompson, DaimlerChrysler - Huntsville Electronics.
Outstanding Paper Award: IMAPS offers a cash award of $500 for papers designated as Outstanding Papers of the Symposium. This year, the award went to "A High Performance Polymer Thin Film Power Electronics Packaging Technology", authored by Raymond A. Fillion, Eladio Delgado, Paul McConnelee and Richard Beaupre, GE Global Research Center.
IMAPS is a society dedicated to the advancement and growth of the use of microelectronics and electronic packaging through professional and public education, the dissemination of information and the promotion of the Society's portfolio of technologies. For more information, visit www.imaps.org.