SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
Nolan’s Notes: Do More, Get More
Global Sourcing Spotlight: Don’t Be Afraid of Global SourcingReliability Analysis Laboratory Expands Component Analysis Service
December 31, 1969 |Estimated reading time: Less than a minute
The addition of a new Real-time X-ray system allows the RAL to non-destructively test a wider variety of miniature parts. Using the system, microelectronic components can be magnified to 200X, allowing for more detailed detection of faults in soldered leads, voids in substrates and die attaches, cracks in ceramics, and placement of internal components. In addition, a new X-ray Fluorescence system quickly and accurately measures the coating thickness and alloy composition of virtually any metal on printed circuit boards, connector contacts, and screws, including single, binary, and ternary alloy coatings, double coatings with one alloy layer, and triple coatings.
By Christine F. Della Monaca
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