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New Products
December 31, 1969 |Estimated reading time: 9 minutes
Laser Drilling MachineLPKF MicroLineDrill 600 is a microvia laser drilling machine that structures HDI boards. It is a specially developed laser for drilling blind holes and reportedly only requires a single process step because the system works with a single laser source. Another advantage is that the metallization can be done immediately without previous cleaning. It is said to produce circuit board structures by directly removing the copper layer and structuring the solder resists, and the drilling and cutting of ceramics reportedly to enable smaller and mid-sized PCB manufacturers to produce high-quality HDI boards. LPKF Laser & Electronics, Wilsonville, Ore.
Epoxy-based Glob TopsTwo low-viscosity, epoxy-based glob tops have been engineered to meet a wide range of applications. Both products reportedly are intended for encapsulating wire bonded bare dies on ceramic and similar substrates and offer consistent processing, easier dispensing and lower cost of use. 50302 HT is said to be the more thixotropic material and is ideal for use on ICs with high-wire profiles and in situations in which glob-top spreading during cure must be minimized. The lower viscosity material, 50302-2, is recommended for use with larger ICs and for ICs with a high-wire count. Emerson & Cuming, Billerica, Mass.
SMT Modular JackGM-SMT2-S6 Series are surface mount modular jacks in tape-and-reel packaging. The fully shielded connector measures 0.463" in height, and is made from reflow-compatible, high-temperature thermoplastic. This series reportedly features positioning pegs to prevent surface mount signal misalignment and true SMT ground tabs. This connector is designed for pick-and-place. The shield material is tin-plated copper alloy, and the contact plating is available as gold flash or 50 μ". Kycon Inc., San Jose, Calif.
PowerStation UpgradePowerStation v. 1.2.0 CAM upgrade software for PCB manufacturing introduces users to important new options and features unavailable in previous versions. One highlight of this upgrade is that, for the first time, users reportedly will have the option to load ODB++ files. This input option also supports part (component) information for added data intelligence. Additionally, this product is said to have two outputs one for the MANIA Pegasus Flying Probe machine and another for MANIA Speedy Flying Probe machine. These outputs reportedly allow users to create machine programs that interface seamlessly with the MANIA Flying Probe machines. GraphiCode Inc., Mountlake Terrace, Wash.
Thermal Interface MaterialPOLARCHIP thermal interface material is a compressible, thermally conductive material suited for filling the undesirable air gaps between heat-generating devices on PCBs and heat sinks, heat spreaders, and metal chassis that dissipate the heat. The material reportedly is a fluoropolymer composite that consists of an expanded polytetrafluoroethylene matrix filled with boron nitride particles. Common applications are said to include laptop computers, high-speed telecommunications equipment and wireless infrastructure equipment. W.L. Gore & Associates, Newark, Del.
Adhesive Selection GuideThe third edition of the MIXPAC Adhesive Selection Guide reportedly contains hundreds of acrylic, epoxy, silicon and urethane adhesives, all organized by manufacturer and adhesive type. All adhesives are available "off-the-shelf," meaning that they are ready to ship without preparation or lead time. The guide is said to assist users in contacting the adhesive manufacturers directly, and contains a table of industrial expertise that helps readers find formulators with experience in specific industries. A comprehensive glossary includes many technical adhesive terms used throughout the industry. ConProTec Inc., Salem, N.H.
DISPENSING EQUIPMENT
Modular Dispensing Platform PumpDV-7300 Heli-Flow rotary positive displacement auger pump features a series of hardened augers for dispensing epoxy-filled material with high-flow rate for fast dam writing. The pump reportedly features interchangeable cartridges that are available in a luer needle configuration. Unlike stand auger pumps, the feedscrew is not custom fit to the pump body and can be replaced. Multiple feed screws and cartridges are said to be purchased to maximize the valve's application capabilities at lower costs. Asymtek, A Nordson Co., Carlsbad, Calif.
Filling Systems8000BF syringe filling systems allow users to load 3 to 55 cc syringes from the bottom up with ±2 percent accuracy. These compact, versatile fillers are said to be fed from drums, pails or cartridges and handle a variety of adhesive viscosities, ranging from gel cyanoacrylates to thick sealants. The fillers reportedly are designed to be used with the company's silicone-free syringes, pistons and caps to give adhesive packagers the ability to fill each syringe with the right amount of material. EFD Inc., East Providence, R.I.
Shot MeterAn economy shot meter, KDS834A uses an 8-bit microprocessor in its digital timer control, with time duration adjustable from 0.01 to 99.99 seconds. The low-voltage unit reportedly includes a vacuum feature to prevent dripping, a time duration indicator light (LED), electrical foot pedal actuation, slide switch for easy change from 110 to 220 V, and a 0 to 100 psi regulator and gage with locking ring. Applications are said to include SMT repair, component sealing, flux dispensing, solder paste dispensing, encapsulation, metal bonding and potting. Kahnetics, a CooperTools brand, Raleigh, N.C.
HARDWARE AND ACCESSORIES
Splash-resistant SocketsInterpower panel-mount sockets are suitable for environments with airborne dirt and splashing liquid. The spring-loaded flip lid reportedly covers the electrical outlet, protecting the socket from contaminants when a plug is not engaged. Sockets have a uniform size of the panel cutout, so the socket can be interchanged without retooling the outer box. Splash-resistant sockets are said to carry the IP 44 standard that classifies them as being safe against solid objects greater than 1.0 mm and splashing water. Panel Components Corp., Oskaloosa, Iowa.
Battery HolderThis "slim line" holder is for 20 mm coin cells used in high-density applications, and mounts securely for wave soldering. Once mounted, the holder reportedly allows quick and easy coin cell installation and replacement from the top. The polarized spring contacts ensure proper installation and circuit protection, as well as low contact resistance. After insertion, the cell is said to be retained securely to withstand shock and vibration. Keystone Electronics Corp., Astoria, N.Y.
FIP GasketsGA100 Series silicone-free formed-in-place (FIP) gaskets cure completely upon exposure to UV light in seconds. These gaskets reportedly allow parts assembly immediately and are composed of five formulations that represent a range of properties suitable for various different gasket applications. Properties defining each of the five gaskets include adhesion to substrates, hardness, compression set, thermal range, water absorption, cure depth and viscosity. Viscosities range from 450 to 60,000 cP and compression sets generally are in the range of 5 to 10 percent. Dymax Corp., Torrington, Conn.
REWORK/REPAIR
RF Laser SystemsLS-120 and LS-180 laser systems are for fast, precise rework of RF shielding. Using targeted laser sources, the LS series is said to desolder and solder RF shields safely in densely populated electronics assemblies in 30 seconds or less. Surface temperature of the RF shield reportedly is monitored precisely using a pyrometer to ensure that chips beneath the shield remain at an acceptable temperature. The pyrometer controls laser intensity and speed as it traces the base of the shield during the rework process. Thus, the systems prevent the reflow of adjacent and shielded components, eliminate hand-tooling costs, and increase the speed at which RF shielding may be reworked. ViTechnology LLC, Haverhill, Mass.
Fume Extraction and Purification SystemPurex powerflow fume extraction and purification system features a vacuum control capability. By automatically keeping airflow constant, accurate temperature profiles reportedly are maintained in reflow ovens and wavesoldering machines. Thermal shock risk is said to be minimized, improving product quality and reducing reject rates. The microprocessor-controlled Intelligent Purification Control Program (IPCP) monitors the vacuum in the system and automatically varies the "pumps" motor speed to keep a constant vacuum. Hi-Tech UK, Rotherham, United Kingdom.
Repair KitThe Professional Repair Kit repairs damaged circuits, lands, surface mount pads and gold-edge contacts. It also is said to include the necessary materials to repair burns and defects in the base board and mask. The kit consists of dry film, epoxy-backed circuit frames and unique replacement circuits that require no liquid epoxy. Also included are eyelets and setting tools for plated-through hole repair, circuit tracks to repair damaged circuits, epoxy and color agents for solder mask or base board repairs, and a comprehensive manual. Circuit Technology Center Inc., Haverhill, Mass.
SMT MATERIALS
UV Curable Adhesive/SealantUV15-7LRI single-component, high-viscosity optically clear UV-curable adhesive matches the refractive index of glass (1.481). This system reportedly cures within 5 to 25 seconds at room temperature when exposed to UV light, depending on light intensity. The cure of this compound can be carried out in the presence of air. High bond strengths are said to be obtained with glass and ceramics as well as various other substrates including optical plastics. The bond is durable over time, even when exposed to adverse environmental conditions, including heat and moisture. Master Bond Inc., Hackensack, N.J.
Silicone Conformal CoatingAn addition to the line of silicone conformal coatings for PC assemblies, 1C49LV is a 100 percent solid coating said to be environmentally friendly. Because it needs no solvent for maximum performance and is ambient moisture-cured, there are no VOC concerns. The ambient-moisture curing reportedly makes it a cost-effective coating alternative because it eliminates the need for expensive heat or UV curing equipment. The coating is said to be applied by dipping, spraying, brushing or through automated selective coating machines. HumiSeal, A Div. of Chase Corp., Woodside, N.Y.
Heat DissipatorsA line of adhesive-backed peel-and-stick heat sinks has been developed for use with BGAs, PGAs, PLCCs, QFPs, CSPs, microBGAs, flat pack packages and cooling applications with limited clip space. Features reportedly include: assembly cost reduction; no messy adhesives or greases required; strong echanical bond; thermally optimized pin fin; and adhesive shear strength at 100°C is 36 psi. International Electronic Research Corp., A CTS Co., Burbank, Calif.
TEST EQUIPMENT
Strip Contactor TechnologyStrip contactor test technology is for simultaneous massively parallel test, and provides design strategies for kelvin, high-current and thermal applications. This test methodology is said to make it possible to test unlimited device sites based on tester resources. A complete turnkey package, from performance board through contactor interface manufacturing solutions, is available. Everett Charles Technologies, Pomona, Calif.
Low-cost ProbesLow-cost, quick-disconnect resistance/ resistivity probes, the 840 Series is a line of resistance measuring instruments. Designed for use with the company's 800 Series Meters, the probes also may be used with other manufacturers' meters. Model 848 Universal Handle Assembly, designed to allow the probes to be changed in a matter of seconds, reportedly features a machined Delrin housing, BNC connection and a 3', two-conductor shielded Teflon cable terminated with standard banana plugs. Alternately, the probes may be used with a standard shielded BNC cable in place of the handle. Electro-Tech Systems Inc., Glenside, Pa.
Wafer Evaluation ProbeThe Multicontact Eye-Pass Probe reportedly provides multiple simultaneous connections to a wafer or similar device. The connections may be ground, logic, power supply, AC signal or power sense path. For power supply connections, the probe's high-performance power bypassing technology reportedly provides low-impedance and resonance-free power connections over a wide frequency range. The device is said to provide controlled impedance power connections, enabling functional test of even the most challenging circuits. Cascade Microtech Inc., Beaverton, Ore.