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December 31, 1969 |Estimated reading time: 2 minutes
August 16, 2001 - Featuring SMT Materials
Self-Leveling Adhesive CoatingsThe SS-5001 (acetoxy), SS-6001 (oxime cure) and SS-6001F (oxime cure) are new self-leveling adhesive coatings used in industrial assembly and sealing applications. All three offer low viscosity, fast room-temperature cure, high-temperature resistance and unprimed adhesion to a wide variety of substrates including aluminum, steel and many plastics. Silicone Solutions, Twinsburg, Ohio www.siliconesolutions.com
High-Performance Epoxy CompoundThe new polymer system EP39MHT is said to be a unique high-performance epoxy compound that combines easy processability with physical strength properties, electrical insulation and chemical inertness for service of up to 450ºF. It is a two-part component system that readily cures at ambient or more quickly at elevated temperatures. It reportedly is 100 percent reactive and does not contain any volatiles. Said to be suitable for potting, encapsulation, sealing and bonding applications, it develops very little heat during the curing reaction. It can also be color-coded to facilitate processing. Master Bond Inc., Hackensack, N.J. www.masterbond.com
Silicone EncapsulantThe new 5071, a new UV cure silicone encapsulant, was designed to mask sensitive fine pitch leads and protect them from environmental damage caused by extreme thermal cycling conditions. The product is a one-part thixotropic silicone paste formulated to cure into a protective elastomer in seconds on exposure to UV light. This masking material reportedly offers an excellent depth of cure and is easy to remove post-cure, thus simplifying component rework. The encapsulant is said to be ideal for automotive electronics and other applications that require extreme thermal cycling resistance. Loctite Corp., Rocky Hill, Conn. www.loctite.com/electronics
Electrically Conductive PPS GradesSix electrically conductive grades of Fortron polyphenylene sulfide (PPS) with highly consistent volume resistivities have been introduced for electronic applications where electrostatic dissipation is important. Four of the grades are moderately conductive with volume resistivities of 106 to 1010 ohm/square, a highly desirable range that is said to be difficult to commercially produce. The new line of specialty products is compounded with novel carbon-based materials that feature conductive fillers uniformly blended to ensure that resistivity is evenly distributed on part surfaces and that volume resistivity is comparable in the central and skin layers. The uniformity of the carbon-based filler greatly reduces irregularities in charge buildup in molded parts that can affect sensitive electronics. Ticona, a business of Celanese AG, Summit, N.J. www.ticona-us.com
Glob Top EncapsulantThe 3534, a high-purity liquid epoxy glob top encapsulant for chip-on-board applications, is said to be particularly suited for use on diodes, sensors, ASICS, PCMCIA, power modules and multi-chip modules that do not offer potting indentations. The product reportedly offers controlled flow to encapsulate electronic devices and penetrate through wire leads. Formulated to dispense easily and exhibit minimal slumping, the encapsulant cures in 30 minutes at 150ºC. The product was designed to minimize stresses, offer excellent chemical resistance and provide improved temperature cycling performance. Loctite Corp., Rocky Hill, Conn. www.loctite.com/electronics